The advancement of printed electronics technology has significantly facilitated the development of electronic engineering. However, so far there still remain big barriers to impede the currently available printing technologies from being extensively used. Many of the difficulties came from the factors like: complicated ink-configurations, high post-treatment temperature, poor conductivity in room temperature and extremely high cost and time consuming fabrication process. From an alternative strategy, our recently invented desktop liquid metal printer offered a flexible way to better address the above deficiencies. Through modifying the system developed in the authors’ lab, here we demonstrated the feasibility of the method in quickly and reliably printing out various large area electronic circuits. Particularly, the liquid metal ink made of GaIn24.5 alloy, with a high electrical resistivity of 2.98×10−7 Ω·m, can be rapidly printed on polyvinyl chloride (PVC) substrate with maximum sizes spanning from centimeter size to meter large. Most important of all, all these manufactures were achieved at an extremely low cost level which clearly shows the ubiquitous value of the liquid metal printer. To evaluate the working performance of the present electronics fabrication method, the electrical resistance and wire width of the printed circuits were investigated under multiple overprinting cycles. For practical illustration purpose, LED lighting conductive patterns which can serve as a functional electronic decoration art were fabricated on the flexible plastic substrate. The present work sets up an example for directly making large-scale ending consumer electronics via a high-efficiency and low-cost way.
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ASME 2014 International Mechanical Engineering Congress and Exposition
November 14–20, 2014
Montreal, Quebec, Canada
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4963-7
PROCEEDINGS PAPER
Liquid Metal Printing for Manufacturing Large-Scale Flexible Electronic Circuits
Yi Zheng,
Yi Zheng
Chinese Academy of Sciences, Beijing, China
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Zhi-Zhu He,
Zhi-Zhu He
Chinese Academy of Sciences, Beijing, China
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Jun Yang,
Jun Yang
Chinese Academy of Sciences, Beijing, China
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Jing Liu
Jing Liu
Chinese Academy of Sciences, Beijing, China
Tsinghua University, Beijing, China
Search for other works by this author on:
Yi Zheng
Chinese Academy of Sciences, Beijing, China
Zhi-Zhu He
Chinese Academy of Sciences, Beijing, China
Jun Yang
Chinese Academy of Sciences, Beijing, China
Jing Liu
Chinese Academy of Sciences, Beijing, China
Tsinghua University, Beijing, China
Paper No:
IMECE2014-37763, V014T11A034; 5 pages
Published Online:
March 13, 2015
Citation
Zheng, Y, He, Z, Yang, J, & Liu, J. "Liquid Metal Printing for Manufacturing Large-Scale Flexible Electronic Circuits." Proceedings of the ASME 2014 International Mechanical Engineering Congress and Exposition. Volume 14: Emerging Technologies; Engineering Management, Safety, Ethics, Society, and Education; Materials: Genetics to Structures. Montreal, Quebec, Canada. November 14–20, 2014. V014T11A034. ASME. https://doi.org/10.1115/IMECE2014-37763
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