In this study, heat transfer analyses of copper bus bars which are installed in industrial switchgear have been conducted in order to obtain the heat transfer correlations for cooling design. The numerical analysis of temperature rise phenomena of copper busbars is carried out using a CFD (Computational Fluid Dynamics) code with various installation conditions under natural convection. The temperature rise test of copper busbars is conducted to provide useful database for verification of numerical analysis. Particularly various geometry and arrangement conditions such as number of parallel busbars and installation angels and gaps between the parallel busbars are considered in the numerical analysis to evaluate the cooling performance of busbars. From the comparisons between experimental and numerical results, it is found out that the obtained heat transfer correlations can predict temperature rise of busbars arranged in the switchgear.

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