In this research, uniformity of temperature on wafer in fine scale was investigated. A measurement system has been developed, and a sensor as thin-film thermocouple was fabricated using a lift-off process. To generate EMF voltage by Seebeck effect, Chromel and Alumel materials were used for the thermocouple. The system obtains the micro scale temperature from multi-points on the surface of the wafer and then precisely analyzes thermal distribution. A numerical analysis was performed to compare to the measurement method. The experimental results and the analysis shows the system can be used for thermal measurement in a micro scale.
Micro-Scale Thermal Sensor Manufacturing and Measurement of Temperature Uniformity on Wafer Surface
- Views Icon Views
- Share Icon Share
- Search Site
Kim, JY, Jang, KM, Yang, HC, & Kim, K. "Micro-Scale Thermal Sensor Manufacturing and Measurement of Temperature Uniformity on Wafer Surface." Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition. Volume 10: Micro- and Nano-Systems Engineering and Packaging. San Diego, California, USA. November 15–21, 2013. V010T11A070. ASME. https://doi.org/10.1115/IMECE2013-65537
Download citation file: