The heat sinks are used to dissipate heat from electronic and industrial systems. In the present study, in order to overcome limitation of traditional heat sink, we suggest and experimentally investigate new concept of heat sink which use evaporation of water. The heat sink is made from sintered copper plate and absorbs supplied water like sponges by capillarity-driven wetting. The absorbed water evaporates at the surface of heat sink and the surface temperature is dropped due to the latent heat of water evaporation. In this study, we experimentally compare the heat dissipation performance of the suggested heat sink with traditional heat sink. And we investigate the performance of heat sink made from the sintered copper plate with various particle radius and porosities. Finally, we find the fin spacing, at which the thermal performance is maximized.
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ASME 2013 International Mechanical Engineering Congress and Exposition
November 15–21, 2013
San Diego, California, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5635-2
PROCEEDINGS PAPER
Experimental Study on Evaporative Heat Sink
Moo Joong Kim,
Moo Joong Kim
Ajou University, Suwon, Korea
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Kuen Tae Park,
Kuen Tae Park
Ajou University, Suwon, Korea
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Hyun Jung Kim,
Hyun Jung Kim
Ajou University, Suwon, Korea
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Dong-Kwon Kim
Dong-Kwon Kim
Ajou University, Suwon, Korea
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Moo Joong Kim
Ajou University, Suwon, Korea
Sangjin Kim
Ajou University, Suwon, Korea
Kuen Tae Park
Ajou University, Suwon, Korea
Hyun Jung Kim
Ajou University, Suwon, Korea
Dong-Kwon Kim
Ajou University, Suwon, Korea
Paper No:
IMECE2013-64370, V08BT09A029; 4 pages
Published Online:
April 2, 2014
Citation
Kim, MJ, Kim, S, Park, KT, Kim, HJ, & Kim, D. "Experimental Study on Evaporative Heat Sink." Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition. Volume 8B: Heat Transfer and Thermal Engineering. San Diego, California, USA. November 15–21, 2013. V08BT09A029. ASME. https://doi.org/10.1115/IMECE2013-64370
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