A novel Inorganic Aqueous Solution (IAS) is shown to have a better thermal performance than water when used as the working fluid in copper or aluminum made heat transfer devices. The effect of each chemical in the IAS and how it benefits heat transfer performance for different materials is explained. It was found that the IAS fluid reacts with copper and coats the surface with a layer of hydrophilic products during the initial boiling process. The surface roughness and wettability were increased which led to an enhanced heat transfer performance. The IAS passivates aluminum surfaces and makes water compatible for use with aluminum heat transfer devices. In addition, IAS has potential to improve the heat transfer performance by 50% lower the superheat when used with non-reactive material heat transfer devices.

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