Similar to electrical probing of semiconductor chips, mechanical probing of MEMS chips (especially containing moving elements) is essential to verify their functionality before packaging. The functionality may include as simple as verification of release of the device from substrate or more sophisticated force vs displacement performance characterization. In this paper we develop a novel mechanical probing station based on the parallelogram flexure mechanism with a magnetic coil as an actuator for probing. We propose a design which allows application of forces in two directions. The proposed design is realized in practice using mechanical and electronic modifications in a standard CD ROM head. The mechanical probe station is calibrated for applied voltage vs force. Successful probing of micro-flexural NOT gate and pneumatic actuator, fabricated by SOIMUMPs process, is demonstrated.

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