Similar to electrical probing of semiconductor chips, mechanical probing of MEMS chips (especially containing moving elements) is essential to verify their functionality before packaging. The functionality may include as simple as verification of release of the device from substrate or more sophisticated force vs displacement performance characterization. In this paper we develop a novel mechanical probing station based on the parallelogram flexure mechanism with a magnetic coil as an actuator for probing. We propose a design which allows application of forces in two directions. The proposed design is realized in practice using mechanical and electronic modifications in a standard CD ROM head. The mechanical probe station is calibrated for applied voltage vs force. Successful probing of micro-flexural NOT gate and pneumatic actuator, fabricated by SOIMUMPs process, is demonstrated.
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ASME 2011 International Mechanical Engineering Congress and Exposition
November 11–17, 2011
Denver, Colorado, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5497-6
PROCEEDINGS PAPER
Development of Mechanical Probe Station for Characterization of Micro-Flexure Mechanisms
Prasanna S. Gandhi,
Prasanna S. Gandhi
Indian Institute of Technology Bombay, Mumbai, MH, India
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Vishal Prajapati,
Vishal Prajapati
Banaras Hindu University, Varanasi, UP, India
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Himani Shah,
Himani Shah
Indian Institute of Technology Bombay, Mumbai, MH, India
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Ramanath Pai
Ramanath Pai
Indian Institute of Technology Bombay, Mumbai, MH, India
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Prasanna S. Gandhi
Indian Institute of Technology Bombay, Mumbai, MH, India
Vishal Prajapati
Banaras Hindu University, Varanasi, UP, India
Himani Shah
Indian Institute of Technology Bombay, Mumbai, MH, India
Ramanath Pai
Indian Institute of Technology Bombay, Mumbai, MH, India
Paper No:
IMECE2011-62912, pp. 439-445; 7 pages
Published Online:
August 1, 2012
Citation
Gandhi, PS, Prajapati, V, Shah, H, & Pai, R. "Development of Mechanical Probe Station for Characterization of Micro-Flexure Mechanisms." Proceedings of the ASME 2011 International Mechanical Engineering Congress and Exposition. Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration. Denver, Colorado, USA. November 11–17, 2011. pp. 439-445. ASME. https://doi.org/10.1115/IMECE2011-62912
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