Solid-solid phononic crystals (solid inclusions in a solid matrix) exhibit wider bandgaps than those observed with air-solid phononic crystals (air inclusions in a solid matrix). In a solid-solid phononic crystal operating in the low MHz range, it is essential to place release holes in the center of the inclusions to release devices from the substrate. It is necessary to release, and therefore suspend the phononic crystal to avoid propagation losses through the substrate. In this report we investigate the effect of release holes on phononic bandgaps and highlight the need for careful design to avoid compromising the phononic bandgap. Studying release issues for solid-solid phononic crystals is essential for the successful fabrication of such devices.
Effect of Release Holes on Micro-Scale Solid-Solid Phononic Crystals
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Su, M, Reinke, C, Soliman, Y, Leseman, Z, Olsson, R, III, & El-Kady, I. "Effect of Release Holes on Micro-Scale Solid-Solid Phononic Crystals." Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition. Volume 13: Sound, Vibration and Design. Vancouver, British Columbia, Canada. November 12–18, 2010. pp. 395-399. ASME. https://doi.org/10.1115/IMECE2010-39403
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