The accuracy of predictions of thermal boundary conductance using traditional models such as the diffuse mismatch model (DMM) varies depending on the types of material comprising the interface. These traditional models assume that phonons are elastically scattered which drives the energy conductance across the interface. It has been shown that at relatively high temperatures (i.e., above the Debye temperature) inelastic scattering events can drive interfacial transport. In this case, the predictions from traditional models become highly inaccurate. In this paper, the effects of inelastic scattering on thermal boundary conductance at metal/dielectric interfaces are studied. Experimental transient thermoreflectance data showing inelastic trends are reviewed and compared to traditional models. Using the physical assumptions in the traditional models and the experimental data, the relative contributions of inelastic and elastic scattering on thermal boundary conductance is inferred.
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ASME 2007 International Mechanical Engineering Congress and Exposition
November 11–15, 2007
Seattle, Washington, USA
Conference Sponsors:
- ASME
ISBN:
0-7918-4305-X
PROCEEDINGS PAPER
Effects of Inelastic Scattering on Thermal Boundary Conductance at Metal-Dielectric Interfaces
Patrick E. Hopkins,
Patrick E. Hopkins
University of Virginia, Charlottesville, VA
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Pamela M. Norris,
Pamela M. Norris
University of Virginia, Charlottesville, VA
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Robert J. Stevens
Robert J. Stevens
Rochester Institute of Technology, Rochester, NY
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Patrick E. Hopkins
University of Virginia, Charlottesville, VA
Pamela M. Norris
University of Virginia, Charlottesville, VA
Robert J. Stevens
Rochester Institute of Technology, Rochester, NY
Paper No:
IMECE2007-42808, pp. 647-656; 10 pages
Published Online:
May 22, 2009
Citation
Hopkins, PE, Norris, PM, & Stevens, RJ. "Effects of Inelastic Scattering on Thermal Boundary Conductance at Metal-Dielectric Interfaces." Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 11: Micro and Nano Systems, Parts A and B. Seattle, Washington, USA. November 11–15, 2007. pp. 647-656. ASME. https://doi.org/10.1115/IMECE2007-42808
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