This study examines the effects of bond pads on the measurement of thermal conductivity for micromachined polycrystalline silicon using suspended test structures and a steady state resistance method. Bond pad heating can invalidate the assumption of constant temperature boundary conditions used for data analysis. Bond pad temperatures above the heat sink temperature arise from conduction out of the bridge test element and Joule heating in the bond pad. Simulations results determined correction factors for the electrical resistance offset, Joule heating effects in the beam, and Joule heating in the bond pads. Fillets at the base of the beam reduce the effect of bond pad heating until they become too large.

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