The study develops an analytical model of an optimized small scale refrigeration system using ejector vapor compression, with application to the cooling of the electronic components populating a Printed Circuit Board (PCB) in a High-Power Microelectronics System. The authors' previous studies [1 - 3] evaluated a vapor compression system using an off-the-shelf mechanical compressor and associated components, focusing mainly on the thermal feasibility of the mechanical refrigeration system and on-chip system-level incorporation. Present investigation focuses on the miniaturization of the various components of the vapor compression system (targeting the alternative ejector vapor compressor), with the intent to establish a cooling system for high power microelectronics, designed to fit smaller packages populating PCB, yet using a different approach for the vapor compression process. The previous study [1] evaluated several optimized evaporator designs for the mechanical compression system. The current design with miniaturized ejector is evaluated to address similar power dissipation ranges as before. In the final section of the study, the efficiency of the proposed ejector vapor compression system is compared to mechanical compression designs at same cooling powers. It is the intent of the authors to present an alternative vapor compression system and identify the pros and cons of implementing such a system to real-life microelectronics applications.

1.
Chiriac, V. and Chiriac, F - “The Optimization of a Refrigeration Vapor Compression System for Power Microelectronics”, Proceedings of IEEE ITHERM06, San Diego, California, 2006.
2.
Chiriac, V. and Chiriac, F - “An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration”, Proceedings of ASME InterPACK’05, San Francisco, California, 2005.
3.
Phelan, P.E., Swanson, J., Chiriac, F., & Chiriac, V., 2004, “Designing a Mesoscale Vapor Compression Refrigerator for Cooling High-Power Microelectronics,” Proceedings of ITHERM’04, Las Vegas, NV, USA.
4.
Chiriac, F., “Refrigeration Machines - Handbook No. 2”, Technical University Bucharest Printing, 1973.
5.
Handbuch der Kaeltetechnik, Band 5, Kaeltemaschinen, Springer Vrelag, 1961.
6.
Handbook of ASHRAE Fundamentals, 1997.
7.
Kandlikar
S. G.
,
2002
, “
Two-Phase Flow Patterns, Pressure Drop and Heat Transfer during Boiling in Minichannel Flow Passages of Compact Evaporators
,”
Heat Transfer Engineering
, Vol.
23
, pp.
5
23
.
8.
Wong
T. N.
, and
Ooi
K. T.
,
1995
, “
Refrigerant Flow in a Capillary Tube: an Assessment of the Two-Phase Viscosity Correlations on Model Prediction
,”
Int. Comm. Heat Mass Transfer
, Vol.
22
, No.
4
, pp.
595
604
.
9.
Yang
C. Y.
, and
Shieh
C., C.
, “
Flow Pattern of Air-Water and Two-Phase R-134a in Small Circular Tubes
”,
Int. Journal of Multiphase Flow
, Vol.
27
, pp.
1163
1177
.
10.
Phelan, P.E., Chiriac, V., & Lee, T.-Y., 2003, “Performance Comparison of Mesoscale Refrigeration Technologies for Electronics Packaging”, Proceedings of IPACK03, July 6-11, Maui, Hawaii, USA.
11.
Phelan
P. E.
,
Chiriac
V.
, &
Lee
T.
,
2002
, “
Current-Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics
,”
IEEE Transactions on Components and Packaging Technologies
, Vol.
25
, pp.
356
365
.
12.
Chiriac, F., Hie, A., Dumitrescu, R., 2003, “Ammonia Condensation Heat Transfer in Air-Cooled Mesochannel Heat Exchangers”, Proceedings of ASME IMECE, Washington DC.
This content is only available via PDF.
You do not currently have access to this content.