Experimental and numerical results are presented for evaporative heat transfer from ten-micron square open-top channels. The radial channels are fabricated in epoxy photoresist on a two micron thick silicon membrane. The working fluid is pumped by capillary forces from a reservoir at the edge of the silicon membrane into the channels where it evaporates. The electrical power dissipated in a thin-film heater in the center of the membrane, the conduction heat transfer rate radially out of the membrane, and the rate of evaporation of the working fluid are measured. A three-dimensional finite difference, time-domain integration is used to predict sensible and latent heat transfer rates. Only 5-10% of the energy dissipated as heat in the thin film heater is carried away as latent heat by the evaporating working fluid. Computed temperatures and heat transfer rates are shown to match the experimental results.
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ASME 2006 International Mechanical Engineering Congress and
Exposition
November 5–10, 2006
Chicago, Illinois, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4785-3
PROCEEDINGS PAPER
Experimental and Numerical Study of Evaporative Heat Transfer From Ten- Micro Microchannels
C. D. Richards,
C. D. Richards
Washington State University
Search for other works by this author on:
R. F. Richards
R. F. Richards
Washington State University
Search for other works by this author on:
Hoki Lee
Washington State University
T. A. Quy
Washington State University
C. D. Richards
Washington State University
D. F. Bahr
Washington State University
R. F. Richards
Washington State University
Paper No:
IMECE2006-15587, pp. 371-375; 5 pages
Published Online:
December 14, 2007
Citation
Lee, H, Quy, TA, Richards, CD, Bahr, DF, & Richards, RF. "Experimental and Numerical Study of Evaporative Heat Transfer From Ten- Micro Microchannels." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 2. Chicago, Illinois, USA. November 5–10, 2006. pp. 371-375. ASME. https://doi.org/10.1115/IMECE2006-15587
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