We present results from a new procedure developed to quantify the pull-off force and strain energy release rates associated with stiction-failure in microdevices. The method is analogous to a standard, macro-scale peel test, but carried out using micro-scale devices. Adhesion is initiated by lowering an array of microcantilevers that protrude from a substrate into contact with a separate substrate. Displacement is controlled by a piezo-actuator with sub-nm resolution while alignment is controlled using linear and tilt stages. An interferometric microscope is used to align the array and the substrate and to record deflection profiles and adhesion lengths during peel-off. This geometry is accurately modeled using linear elastic fracture mechanics, creating a robust, reliable, standard method for measuring adhesion energies in stiction-failed microdevices.
A Standard Approach for Measuring Adhesion Energies in Stiction-Failed Microdevices
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Leseman, ZC, Carlson, S, Xue, X, & Mackin, TJ. "A Standard Approach for Measuring Adhesion Energies in Stiction-Failed Microdevices." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Microelectromechanical Systems. Chicago, Illinois, USA. November 5–10, 2006. pp. 5-13. ASME. https://doi.org/10.1115/IMECE2006-14498
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