Evaporative heat transfer from ten-micron square open-top micro-channels is investigated experimentally. The channels are fabricated by spinning ten microns of SU-8 on a two micron thick silicon membrane and using a photolithography process to create micro channels in radial and annular patterns. The working fluid, FC77, is pumped by capillary forces into the channels from a reservoir at the edge of the silicon membrane. Electrical power is dissipated in a thin-film heater in the center of the membrane. The liquid front of working fluid in the channels is visualized with a long-distance microscope and CCD camera. Sensible heat conducted radially out of the membrane is measured with two concentric annular PRT’s. The mass of working fluid evaporated from the micro-channels is determined gravimetrically. A global energy balance including latent and sensible heat transfer out of the system is then tabulated. The study shows that only five to ten percent of the power going into the membrane is carried away by evaporation while the remaining ninety to ninety-five percent of the power is conducted out along the membrane.
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ASME 2005 International Mechanical Engineering Congress and Exposition
November 5–11, 2005
Orlando, Florida, USA
Conference Sponsors:
- Microelectromechanical Systems Division
ISBN:
0-7918-4224-X
PROCEEDINGS PAPER
Evaporative Heat Transfer From Ten-Micron Micro-Channels
D. A. Carpenter,
D. A. Carpenter
Washington State University
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C. D. Richards,
C. D. Richards
Washington State University
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R. F. Richards
R. F. Richards
Washington State University
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T. A. Quy
Washington State University
D. A. Carpenter
Washington State University
C. D. Richards
Washington State University
D. F. Bahr
Washington State University
R. F. Richards
Washington State University
Paper No:
IMECE2005-81460, pp. 707-710; 4 pages
Published Online:
February 5, 2008
Citation
Quy, TA, Carpenter, DA, Richards, CD, Bahr, DF, & Richards, RF. "Evaporative Heat Transfer From Ten-Micron Micro-Channels." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Microelectromechanical Systems. Orlando, Florida, USA. November 5–11, 2005. pp. 707-710. ASME. https://doi.org/10.1115/IMECE2005-81460
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