State-of-the-art thermal interface materials are briefly reviewed with an emphasis on the emerging trend of using carbon nanotubes to increase interface thermal performance. Vertically aligned multi-walled carbon nanotube (MWCNT) arrays were grown and applied as thermal interfacial enhancing materials. It is expected that the highly thermally conductive channels directly bridging the mating surfaces would significantly enhance the interface thermal conductance. We extended the all-optical pump and probe phase sensitive transient thermo-reflectance (PSTTR) method and used it to measure the interfacial properties of a three-layer sample of a vertically aligned MWCNT array grown on silicon (Si) substrate dry adhered to a glass plate. The dominant thermal resistance is identified as the dry adhered MWCNT-glass interface with a thermal conductance of ~5.9 × 104 W/m2·K, compared with MWCNT-Si interface of almost two orders of magnitude higher. Tentative explanations on the difference in the two interfaces and ways for future improvements are provided. The PSTTR measurement principle and issues are also discussed in the context.
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ASME 2005 International Mechanical Engineering Congress and Exposition
November 5–11, 2005
Orlando, Florida, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4222-3
PROCEEDINGS PAPER
Vertically Aligned Multi-Walled Carbon Nanotube Arrays as Thermal Interface Materials and Measurement Technique
Arun Majumdar,
Arun Majumdar
Lawrence Berkeley National Laboratory
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M. Meyyappan
M. Meyyappan
Nasa Ames Research Center
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Tao Tong
University of California at Berkeley
Yang Zhao
Atlas Scientific, Inc.
Lance Delzeit
NASA Ames Research Center
Ali Kashani
Atlas Scientific, Inc.
Arun Majumdar
Lawrence Berkeley National Laboratory
M. Meyyappan
Nasa Ames Research Center
Paper No:
IMECE2005-81926, pp. 777-783; 7 pages
Published Online:
February 5, 2008
Citation
Tong, T, Zhao, Y, Delzeit, L, Kashani, A, Majumdar, A, & Meyyappan, M. "Vertically Aligned Multi-Walled Carbon Nanotube Arrays as Thermal Interface Materials and Measurement Technique." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Heat Transfer, Part B. Orlando, Florida, USA. November 5–11, 2005. pp. 777-783. ASME. https://doi.org/10.1115/IMECE2005-81926
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