An empirical study of pool nucleate boiling enhanced with a microporous coating was conducted within the context of microprocessor cooling. A thermal test vehicle (TTV) emulated the heat load from a general purpose microprocessor and was used to deliver a non uniform heat flux density distribution at the boiling surface. The TTV was affixed to a copper test coupon that formed the bottom surface of a sealed boiling chamber containing FC-72 at atmospheric pressure. A design of experiments was conducted on multiple test coupons to identify how the microporous coating, the base thickness of the coupon, and the height of small pin fins affect the combined conduction and boiling heat transfer from the test coupon. The data revealed that the presence of the microporous coating was the most significant factor of the three tested and that very short fins (0.5 mm) were sufficient to manage hysterisis in the boiling curve.
Investigation of Microporous Coatings and Meso-Scale Structures for Two-Phase Cooling of Electronic Components
Trautman, MA, Tirumala, M, & You, SM. "Investigation of Microporous Coatings and Meso-Scale Structures for Two-Phase Cooling of Electronic Components." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Heat Transfer, Part A. Orlando, Florida, USA. November 5–11, 2005. pp. 749-754. ASME. https://doi.org/10.1115/IMECE2005-81255
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