In this paper we present results of experimental and molecular dynamics computational investigations of boiling of dielectric liquids with smooth surfaces, with micro-scale porous coatings, and on manufactured corrugated and micro scale pin fin enhanced surfaces. The boiling and condensation processes taking place on these surfaces in the presence of an electrostatic field demonstrate significant differences from these processes occurring without the externally applied electric fields. New effects were discovered, which demonstrate that non-uniformities of temperature fields and externally applied electric fields exert a significant influence on the local and space wise average heat and mass transfer.
New Effects in Interfacial Heat and Mass Transfer of Boiling and Evaporation in Micro-Scale Porous Materials
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Leontiev, AI, Lloyd, JR, Malyshenko, SP, Borzenko, VI, Dunikov, DO, Eronin, AA, & Nazarova, OV. "New Effects in Interfacial Heat and Mass Transfer of Boiling and Evaporation in Micro-Scale Porous Materials." Proceedings of the ASME 2003 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 4. Washington, DC, USA. November 15–21, 2003. pp. 153-161. ASME. https://doi.org/10.1115/IMECE2003-42926
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