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Proceedings Papers

Influence of Surface Roughness on Traction and Scuffing Performance of Lubricated Contacts for Aerospace and Automotive Gearing

Sam Shon, Ahmet Kahraman, Kelsen LaBerge, Brian Dykas, David Stringer
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 87-89, October 7–10, 2012
Paper No: IJTC2012-61212
DOI: https://doi.org/10.1115/IJTC2012-61212
View Paper titled, Influence of Surface Roughness on Traction and Scuffing Performance of Lubricated Contacts for Aerospace and Automotive Gearing
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Topics: Aerospace industry, Surface roughness, Traction, Gears, Polishing, Steel, Automotive transmissions, Disks, Lubricants, Mirrors
Proceedings Papers

Effect of Surface Microtexturing on Friction at Unidirectional Sliding Depending on Lubricant Viscosity

Karl-Heinz Zum Gahr, Mario Mann
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 57-59, October 7–10, 2012
Paper No: IJTC2012-61042
DOI: https://doi.org/10.1115/IJTC2012-61042
View Paper titled, Effect of Surface Microtexturing on Friction at Unidirectional Sliding Depending on Lubricant Viscosity
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Topics: Friction, Lubricants, Viscosity, Disks, Sapphire, Texture (Materials), Water, Film thickness, Geometry, Laser ablation
Proceedings Papers

Development of the GranOO Discrete Element Platform for Dynamic Problems: Application for Tribological Application

Ivan Iordanoff, Jean Luc Charles, Damien Andre
Proc. ASME. IJTC2012, ASME/STLE 2012 International Joint Tribology Conference, 325-329, October 7–10, 2012
Paper No: IJTC2012-61200
DOI: https://doi.org/10.1115/IJTC2012-61200
View Paper titled, Development of the GranOO Discrete Element Platform for Dynamic Problems: Application for Tribological Application
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Topics: Tribology, Particulate matter, Wear, Damage, Differential equations, Electric potential, Engineering simulation, Flow (Dynamics), Licensing, Magnetic moment
Proceedings Papers

On Polishing and Erosion of Aluminum Substrates by a Jet of Alumina Slurry

Shreyansh Patel, Sinan Mu¨ftu¨
Proc. ASME. IJTC2011, ASME/STLE 2011 Joint Tribology Conference, 369-371, October 24–26, 2011
Paper No: IJTC2011-61082
DOI: https://doi.org/10.1115/IJTC2011-61082
View Paper titled, On Polishing and Erosion of Aluminum Substrates by a Jet of Alumina Slurry
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Topics: Aluminum, Erosion, Polishing, Slurries, Computational fluid dynamics, Surface roughness, Jets, Metal surfaces, Particulate matter, Pressure
Proceedings Papers

Effect of Surface Texturing on EHD Lubrication Films Under Transient Speed Condition

Martin Zimmerman, Ivan Krupka, Martin Hartl, Pavel Houska
Proc. ASME. IJTC2011, ASME/STLE 2011 Joint Tribology Conference, 187-189, October 24–26, 2011
Paper No: IJTC2011-61046
DOI: https://doi.org/10.1115/IJTC2011-61046
View Paper titled, Effect of Surface Texturing on EHD Lubrication Films Under Transient Speed Condition
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Topics: Lubrication, Transients (Dynamics), Lubricants, Film thickness, Cams, Damage, Disks, Gears, Glass, Interferometry
Proceedings Papers

Studies on Friction and Transfer Layer Formation When Pure Magnesium Pins Slid at Various Numbers of Cycles on Steel Plates of Different Surface Texture

Pradeep L. Menezes, Kishore, Satish V. Kailas, Michael R. Lovell
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 263-265, October 17–20, 2010
Paper No: IJTC2010-41284
DOI: https://doi.org/10.1115/IJTC2010-41284
View Paper titled, Studies on Friction and Transfer Layer Formation When Pure Magnesium Pins Slid at Various Numbers of Cycles on Steel Plates of Different Surface Texture
Click here to open pdf in another window PDF for Studies on Friction and Transfer Layer Formation When Pure Magnesium Pins Slid at Various Numbers of Cycles on Steel Plates of Different Surface Texture
Topics: Cycles, Friction, Magnesium (Metal), Pins (Engineering), Plates (structures), Steel, Surface texture, Texture (Materials), Stick-slip, Lubrication
Proceedings Papers

The Film Formation Mechanism of High Water-Based Emulsions

Jianbin Luo, Liran Ma
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 439-441, October 17–20, 2010
Paper No: IJTC2010-41283
DOI: https://doi.org/10.1115/IJTC2010-41283
View Paper titled, The Film Formation Mechanism of High Water-Based Emulsions
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Topics: Emulsions, Water, Cutting, Lubricants, Metals, Metalworking, Polishing, Steel
Proceedings Papers

Axiomatic Design of a Multi-Directional Motion Pin on Disk Apparatus for Biotribology Study

Zikai Hua, Jianhua Zhang
Proc. ASME. IJTC2010, STLE/ASME 2010 International Joint Tribology Conference, 37-39, October 17–20, 2010
Paper No: IJTC2010-41039
DOI: https://doi.org/10.1115/IJTC2010-41039
View Paper titled, Axiomatic Design of a Multi-Directional Motion Pin on Disk Apparatus for Biotribology Study
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Topics: Biotribology, Design, Disks, Wear, Adhesives, Artificial limbs, Control systems, Molecular weight, Pins (Engineering), Polishing
Proceedings Papers

A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers

Jeremiah N. Mpagazehe, Geo A. Thukalil, C. Fred Higgs, III
Proc. ASME. IJTC2009, ASME/STLE 2009 International Joint Tribology Conference, 27-29, October 19–21, 2009
Paper No: IJTC2009-15205
DOI: https://doi.org/10.1115/IJTC2009-15205
View Paper titled, A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers
Click here to open pdf in another window PDF for A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers
Topics: Erosion, Physics, Semiconductor wafers, Electrical properties, Integrated circuits, Lubrication, Particulate matter, Polishing
Proceedings Papers

The Effect of Micro Dent Arrays Fabricated by Laser Shock Peening on Tribology

R. Caslaru, Y. B. Guo
Proc. ASME. IJTC2009, ASME/STLE 2009 International Joint Tribology Conference, 451-453, October 19–21, 2009
Paper No: IJTC2009-15113
DOI: https://doi.org/10.1115/IJTC2009-15113
View Paper titled, The Effect of Micro Dent Arrays Fabricated by Laser Shock Peening on Tribology
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Topics: Laser hardening, Tribology, Friction, Density, Fracture (Materials), Lubricants, Microhardness, Micromachining, Polishing, Reservoirs
Proceedings Papers

The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load

Joseph A. Levert, David Haas, Chad S. Korach, Nicholas Lakomcik, Edward Peters
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 731-733, October 20–22, 2008
Paper No: IJTC2008-71217
DOI: https://doi.org/10.1115/IJTC2008-71217
View Paper titled, The Variation of CMP Pad Asperity Friction as a Function of Speed and Normal Load
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Topics: Friction, Stress, Polishing, Slurries, Damage, Deflection, Dielectric materials, Integrated circuits, Manufacturing, Thin films
Proceedings Papers

A Probabilistic Analysis of Third-Body Particle Embedment: Implications in Lapping of Magnetic Recording Heads

H. Xu, K. Komvopoulos
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 169-171, October 20–22, 2008
Paper No: IJTC2008-71242
DOI: https://doi.org/10.1115/IJTC2008-71242
View Paper titled, A Probabilistic Analysis of Third-Body Particle Embedment: Implications in Lapping of Magnetic Recording Heads
Click here to open pdf in another window PDF for A Probabilistic Analysis of Third-Body Particle Embedment: Implications in Lapping of Magnetic Recording Heads
Topics: Grinding, Magnetic recording, Particulate matter, Polishing, Density, Fluids, Geometry, Manufacturing, Particle size, Plates (structures)
Proceedings Papers

Post-CMP Cleaning Applications

V. Khosla, M. Vinogradov, N. V. Gitis, R. K. Singh, D. W. Stockbower, C. R. Wargo
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 719-720, October 20–22, 2008
Paper No: IJTC2008-71017
DOI: https://doi.org/10.1115/IJTC2008-71017
View Paper titled, Post-CMP Cleaning Applications
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Topics: Adhesion, Contamination, Ethanol, Particulate matter, Polishing, Semiconductor wafers, Stability, Surface roughness
Proceedings Papers

Derivation of Reynolds Equation in Cylindrical Coordinates Applicable to Pin-on-Disk and CMP

K. E. Beschorner, C. F. Higgs, III, M. R. Lovell
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 399-401, October 20–22, 2008
Paper No: IJTC2008-71245
DOI: https://doi.org/10.1115/IJTC2008-71245
View Paper titled, Derivation of Reynolds Equation in Cylindrical Coordinates Applicable to Pin-on-Disk and CMP
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Topics: Disks, Pressure, Navier-Stokes equations, Polishing, Shapes, Tribology
Proceedings Papers

On the Effects of Surface Forces on the Contact of a Wafer and Abrasive Particles in CMP

Dinc¸er Bozkaya, Sinan Mu¨ftu¨
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 557-559, October 20–22, 2008
Paper No: IJTC2008-71122
DOI: https://doi.org/10.1115/IJTC2008-71122
View Paper titled, On the Effects of Surface Forces on the Contact of a Wafer and Abrasive Particles in CMP
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Topics: Dielectric materials, Fracture (Materials), Fracture (Process), Particulate matter, Polishing, Pressure, Semiconductor wafers
Proceedings Papers

A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration

Dinc¸er Bozkaya, Sinan Mu¨ftu¨
Proc. ASME. IJTC2008, STLE/ASME 2008 International Joint Tribology Conference, 569-571, October 20–22, 2008
Paper No: IJTC2008-71129
DOI: https://doi.org/10.1115/IJTC2008-71129
View Paper titled, A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration
Click here to open pdf in another window PDF for A Model for Optimizing Material Removal Rate in Low-Pressure CMP: Effects of Pad Porosity and Abrasive Concentration
Topics: Porosity, Pressure, Polishing, Dielectric materials, Semiconductor wafers
Proceedings Papers

A Multi-Physics Particle-Augmented Mixed Lubrication Modeling Approach for Studying CMP

Elon Terrell, C. Fred Higgs, III
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1017-1018, October 22–24, 2007
Paper No: IJTC2007-44487
DOI: https://doi.org/10.1115/IJTC2007-44487
View Paper titled, A Multi-Physics Particle-Augmented Mixed Lubrication Modeling Approach for Studying CMP
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Topics: Lubrication, Modeling, Particulate matter, Physics, Algorithms, Contact mechanics, Fluid mechanics, Particle dynamics, Polishing, Wear
Proceedings Papers

The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals

Joseph Bonivel, Sarah Biltz, Elon Terrell, Burak Ozdoganlar, C. Fred Higgs, III
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1019-1020, October 22–24, 2007
Paper No: IJTC2007-44488
DOI: https://doi.org/10.1115/IJTC2007-44488
View Paper titled, The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals
Click here to open pdf in another window PDF for The Effect of Microstructure on Chemical Mechanical Polishing Process of Thin-Film Metals
Topics: Metals, Polishing, Thin films, Semiconductor wafers, Copper, Data storage systems, Integrated circuits, Manufacturing, Mechanical properties, Nanoindentation
Proceedings Papers

Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips

Joo Hoon Choi, Yangro Lee, Louis E. DeMarco, Richard T. Leveille, Joseph A. Levert, Chad S. Korach
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 749-751, October 22–24, 2007
Paper No: IJTC2007-44383
DOI: https://doi.org/10.1115/IJTC2007-44383
View Paper titled, Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips
Click here to open pdf in another window PDF for Chemical Mechanical Polishing Friction Measurements With Silica Atomic Force Microscope Tips
Topics: Atomic force microscopy, Friction, Polishing, Particulate matter, Scanning probe microscopy, Circuits, Damage, Delamination, Glass, Integrated circuit fabrication
Proceedings Papers

Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing

A. Osorno, S. Tereshko, I. Yoon, S. Danyluk
Proc. ASME. IJTC2007, ASME/STLE 2007 International Joint Tribology Conference, Parts A and B, 1081-1082, October 22–24, 2007
Paper No: IJTC2007-44441
DOI: https://doi.org/10.1115/IJTC2007-44441
View Paper titled, Dynamics of the Formation of the Subambient Pressure Distribution During Chemical-Mechanical Polishing
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Topics: Dynamics (Mechanics), Polishing, Pressure, Semiconductor wafers, Silicon, Particulate matter, Slurries, Electronics, Integrated circuits, Manufacturing