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Keywords: electronic cooling
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Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 283-291, August 8–13, 2010
Paper No: IHTC14-23413
... cooling INTRODUCTION The miniaturization of electronic devices coupled with the advancement in packaging technology led to the quantum leap in the packaging densities and the associated heat fluxes that need to be dissipated. Consequently, the use of highly effective and compact electronics cooling...
Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 671-674, August 8–13, 2010
Paper No: IHTC14-23015
... of the jet with respect to the evaporation surface (i.e., oblique jet impingement). The results from these experiments help elucidate the importance of these two factors in determining the overall performance of the device. Thin-film Gas-Assisted Evaporation Phase change Electronic Cooling High...
Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 629-638, August 8–13, 2010
Paper No: IHTC14-22720
... been proposed. For the data in the range of Re = 1655 ∼ 8960, Bo = 0.024 ∼ 0.389, surface area enhancement ratio (γ A ) = 2.07 ∼ 5.32, this correlation predicts 94% of the present data within ±20%. jet impingement electronic cooling straight fin 1 Copyright © 2010 by ASME Proceedings...