A two-phase heat spreader has been developed for cooling high heat flux sources in high-power lasers, high-intensity light-emitting diodes, and semiconductor power devices. The heat spreader targets the passive cooling of heat sources with fluxes greater than 5 W/mm2 without requiring any active power consumption for the thermal solution. The prototype vapor chamber consists of an evaporator plate, a condenser plate and an adiabatic section, with water as the phase-change fluid. The custom-designed high heat flux source is composed of a platinum resistive heating pattern and a temperature sensor on an aluminum nitride substrate which is soldered to the outside of the evaporator. Experiments were performed with several different microstructures as evaporator surfaces under varying heat loads. The first microstructure investigated, a screen mesh, dissipated 2 W/mm2 of heat load but with an unacceptably high evaporator temperature. A sintered copper powder microstructure with particles of 50 μm mean diameter supported 8.5 W/mm2 without dryout. Four sets of particle diameters and different thicknesses for the sintered copper powder evaporators were tested. Additionally, some of the sintered structures were coated with multi-walled carbon nanotubes (CNT) that were rendered hydrophilic. Such nano-structured evaporators successfully showed a further reduction in thermal resistance of the vapor chamber.
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2010 14th International Heat Transfer Conference
August 8–13, 2010
Washington, DC, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4938-5
PROCEEDINGS PAPER
Nano-Structured Two-Phase Heat Spreader for Cooling Ultra-High Heat Flux Sources
Mitsuo Hashimoto,
Mitsuo Hashimoto
Sony Corporation, Tokyo, Japan
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Hiroyuki Ryoson,
Hiroyuki Ryoson
Sony Corporation, Tokyo, Japan
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Kazuaki Yazawa,
Kazuaki Yazawa
University of California, Santa Cruz, Santa Cruz, CA
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Justin A. Weibel,
Justin A. Weibel
Purdue University, West Lafayette, IN
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Suresh V. Garimella
Suresh V. Garimella
Purdue University, West Lafayette, IN
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Mitsuo Hashimoto
Sony Corporation, Tokyo, Japan
Hiroto Kasai
Sony Corporation, Tokyo, Japan
Kazuma Usami
Sony Corporation, Tokyo, Japan
Hiroyuki Ryoson
Sony Corporation, Tokyo, Japan
Kazuaki Yazawa
University of California, Santa Cruz, Santa Cruz, CA
Justin A. Weibel
Purdue University, West Lafayette, IN
Suresh V. Garimella
Purdue University, West Lafayette, IN
Paper No:
IHTC14-22765, pp. 523-533; 11 pages
Published Online:
March 1, 2011
Citation
Hashimoto, M, Kasai, H, Usami, K, Ryoson, H, Yazawa, K, Weibel, JA, & Garimella, SV. "Nano-Structured Two-Phase Heat Spreader for Cooling Ultra-High Heat Flux Sources." Proceedings of the 2010 14th International Heat Transfer Conference. 2010 14th International Heat Transfer Conference, Volume 3. Washington, DC, USA. August 8–13, 2010. pp. 523-533. ASME. https://doi.org/10.1115/IHTC14-22765
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