With the increase in power densities and decrease in chip and electronic package dimensions, their thermal management is a challenge and is a focus of several ongoing research efforts. To achieve the desired thermal management for optimal device operation, heat generated by the chip has to be effectively transferred to the ambient via several structures of the electronic package. Hence the need for development of high thermal conductivity structures is of prime importance. Heat spreaders quickly spread the heat generated by the chips over a larger area from where it is conducted to the ambient via heat sink. Heat-spreading research from a materials view point involves direct combination of high thermal conductivity materials within the microprocessor substrate. In this paper, a novel nano heat spreader design is proposed. Highly conductive graphene layer is integrated on a silicon carbide substrate on one side and thin films of carbon nano tubes as thermal interface material on the other side. Analytical solutions and case studies are presented to show that the proposed approach for the heat spreader design can yield very high effective thermal conductivity while remaining mechanically flexible, as required for reducing thermal stresses.
- Heat Transfer Division
An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems
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Bhopte, S, Desu, SB, & Sammakia, B. "An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems." Proceedings of the 2010 14th International Heat Transfer Conference. 2010 14th International Heat Transfer Conference, Volume 3. Washington, DC, USA. August 8–13, 2010. pp. 629-635. ASME. https://doi.org/10.1115/IHTC14-22918
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