This work presents survey and selected results in the design of compact heat sinks for semiconductor industry that use concavities, dimples or protrusions, combined structures of dimples and pin-fins with or without micro-channels, and methods of manufacturing based on “wave” technology. Analysis and observations in this work are devoted to the study of flow structure and jet-vortex nature of heat transfer enhancement mechanisms in a single dimple, in an array of dimples and in dimpled channels at a different Reynolds number, dimple depth and dimple shape. Impulse and heat transfer analogy in channels with dimples and protrusions are also considered. The direct numerical simulation and experimental analysis are performed for channels with combined structure of dimples and pin-fins. The thermal resistance and dependences of Nusselt number on Reynolds number are reported for studied arrangements at which dimples do not act as surface vortex generators.

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