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Proceedings Papers

Fatigue Behavior of Adhesive Joints Under Biaxial Loading Conditions

Erol Sancaktar
Proc. ASME. DETC93, 10th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention, 111-123, September 19–22, 1993
Paper No: DETC1993-0067
DOI: https://doi.org/10.1115/DETC1993-0067
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Topics: Adhesive joints, Fatigue, Adhesives, Textiles, Shear (Mechanics), Stress, Aerospace industry, Aircraft, Cantilevers, Data collection
Proceedings Papers

Modeling of Particulate Contamination in Tungsten Low Pressure Chemical Vapor Deposition

Ahmed A. Busnaina, Bruce S. MacGibbon
Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A015, August 18–22, 1996
Paper No: 96-DETC/CIE-1351
DOI: https://doi.org/10.1115/96-DETC/CIE-1351
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Topics: Chemical vapor deposition, Contamination, Modeling, Particulate matter, Pressure, Tungsten, Temperature gradient, Boundary-value problems, Drag (Fluid dynamics), Gravity (Force)
Proceedings Papers

Vibration Testing and Control of Inflatable Structures Using Smart Materials

Gyuhae Park, Myung-Hyun Kim, Matthias Mandin, Daniel J. Inman
Proc. ASME. IDETC-CIE2001, Volume 6B: 18th Biennial Conference on Mechanical Vibration and Noise, 2023-2031, September 9–12, 2001
Paper No: DETC2001/VIB-21540
DOI: https://doi.org/10.1115/DETC2001/VIB-21540
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Topics: Air-supported structures, Smart materials, Testing, Vibration, Actuators, Aerospace industry, Damping, Design, Dynamics (Mechanics), Sensors
Proceedings Papers

Study of Thin Film-Edge Induced Stresses in Silicon Substrates by Infrared Photoelasticity

H. J. Peng, S. P. Wong, Shounan Zhao
Proc. ASME. IDETC-CIE2001, Volume 5: 15th Reliability, Stress Analysis, and Failure Prevention Conference; International Issues in Engineering Design, 17-22, September 9–12, 2001
Paper No: DETC2001/RSAFP-21743
DOI: https://doi.org/10.1115/DETC2001/RSAFP-21743
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Topics: Silicon, Stress, Diffraction patterns, Thin films, Film thickness, Simulation, Stress concentration, Strips
Proceedings Papers

Simulation Assisted Design of LCO Cathode Materials With High Performance Stability

Zhuoyuan Zheng, Parth Bansal, Pingfeng Wang, Yumeng Li
Proc. ASME. IDETC-CIE2020, Volume 11A: 46th Design Automation Conference (DAC), V11AT11A053, August 17–19, 2020
Paper No: DETC2020-22357
DOI: https://doi.org/10.1115/DETC2020-22357
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Topics: Cobalt, Design, Lithium, Lithium-ion batteries, Simulation, Stability, Diffusion (Physics), Finite element model, Active materials, Chemical stability
Proceedings Papers

Design and Simulations of a Novel Stiction-Free Laterally Actuated NEM Relay With Flexible Source-Drain Contact

Mehrdad Zandigohar, Mohammad Shavezipur
Proc. ASME. IDETC-CIE2020, Volume 1: 14th International Conference on Micro- and Nanosystems (MNS), V001T01A007, August 17–19, 2020
Paper No: DETC2020-22721
DOI: https://doi.org/10.1115/DETC2020-22721
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Topics: Design, Engineering simulation, Simulation, Stiction, Stiffness, Adhesion, Separation (Technology), Finite element analysis, Finite element methods, Finite element model
Proceedings Papers

Using Bayesian Optimization With Knowledge Transfer for High Computational Cost Design: A Case Study in Photovoltaics

Mine Kaya, Shima Hajimirza
Proc. ASME. IDETC-CIE2019, Volume 2A: 45th Design Automation Conference, V02AT03A015, August 18–21, 2019
Paper No: DETC2019-98111
DOI: https://doi.org/10.1115/DETC2019-98111
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Topics: Design, Optimization, Photovoltaics, Solar cells, Thin films
Proceedings Papers

A Novel Variable Stiffness Compliant Robotic Gripper Based on Layer Jamming

Yuan Gao, Xiguang Huang, Ishan Singh Mann, Hai-Jun Su
Proc. ASME. IDETC-CIE2019, Volume 5B: 43rd Mechanisms and Robotics Conference, V05BT07A017, August 18–21, 2019
Paper No: DETC2019-98294
DOI: https://doi.org/10.1115/DETC2019-98294
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Topics: End effectors, Stiffness, Stress, Shapes, Cables, Design, Grippers, Pressure, Additive manufacturing, Friction
Proceedings Papers

Experimental Study of Cochlear Dynamics With an Intracochlear Acoustic Micro-Actuator

Sergiy Taylakov, I. Y. Shen
Proc. ASME. IDETC-CIE2019, Volume 8: 31st Conference on Mechanical Vibration and Noise, V008T10A006, August 18–21, 2019
Paper No: DETC2019-97295
DOI: https://doi.org/10.1115/DETC2019-97295
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Topics: Acoustics, Dynamics (Mechanics), Microactuators, Canals, Fluids, Aluminum, Membranes, Cochlear implants, Design, Electrodes
Proceedings Papers

MEMS Based Differential Scanning Calorimeter for Biomolecular Study

Shifeng Yu, Shuyu Wang, Ming Lu, Lei Zuo
Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A003, August 26–29, 2018
Paper No: DETC2018-85484
DOI: https://doi.org/10.1115/DETC2018-85484
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Topics: Microelectromechanical systems, Heat, Heating, Microfluidics, Phase transitions, Plasma desorption mass spectrometry, Proteins, Resolution (Optics), Temperature, Thermodynamics
Proceedings Papers

New Insights Into Shape Memory Alloy Bimorph Actuators Formed by Electron Beam Evaporation

Hao Sun, Jianjun Luo, Ming Lu, Dmytro Nykypanchuk, Yong Shi
Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A019, August 26–29, 2018
Paper No: DETC2018-85812
DOI: https://doi.org/10.1115/DETC2018-85812
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Topics: Actuators, Electron beams, Evaporation, Shape memory alloys, Nickel titanium alloys, Annealing, Microactuators, Dry etching, Finite element analysis, Manufacturing
Proceedings Papers

Modeling Large Deformation Impact Dynamics for Legged Microrobot Locomotion: A Preliminary Formulation

Nikhil Potu Surya Prakash, Kenn Oldham
Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A030, August 26–29, 2018
Paper No: DETC2018-85923
DOI: https://doi.org/10.1115/DETC2018-85923
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Topics: Deformation, Dynamics (Mechanics), Modeling, Robots, Finite element analysis, Collisions (Physics), Density, Dynamic modeling, Dynamic models, Impulse (Physics)
Proceedings Papers

Semiconductor to Metal Transition Study of Oxidized Vanadium Thin Film

Shifeng Yu, Shuyu Wang, Ming Lu, Lei Zuo
Proc. ASME. IDETC-CIE2017, Volume 4: 22nd Design for Manufacturing and the Life Cycle Conference; 11th International Conference on Micro- and Nanosystems, V004T09A017, August 6–9, 2017
Paper No: DETC2017-67926
DOI: https://doi.org/10.1115/DETC2017-67926
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Topics: Metals, Semiconductors (Materials), Thin films, Temperature, Atoms, Electrical resistivity, Shells
Proceedings Papers

Nonlinear-Based Switch Triggered by Gas Using Electrostatically Actuated Microbeams

Adam Bouchaala, Nizar Jaber, Omar Yassine, Osama Shekhah, Mohamed Eddaoudi, Mohammad I. Younis
Proc. ASME. IDETC-CIE2016, Volume 4: 21st Design for Manufacturing and the Life Cycle Conference; 10th International Conference on Micro- and Nanosystems, V004T08A006, August 21–24, 2016
Paper No: DETC2016-59815
DOI: https://doi.org/10.1115/DETC2016-59815
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Topics: Microbeams, Switches, Algorithms, Noise (Sound), Hardening, Metals, Microelectromechanical systems, Micromachining, Stability, Thin films
Proceedings Papers

Characterization and Design of Functional Quasi-Random Nanostructured Materials Using Spectral Density Function

Shuangcheng Yu, Yichi Zhang, Chen Wang, Won-kyu Lee, Biqin Dong, Teri W. Odom, Cheng Sun, Wei Chen
Proc. ASME. IDETC-CIE2016, Volume 2B: 42nd Design Automation Conference, V02BT03A012, August 21–24, 2016
Paper No: DETC2016-60118
DOI: https://doi.org/10.1115/DETC2016-60118
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Topics: Design, Nanomaterials, Spectral energy distribution, Design methodology, Manufacturing, Nanomanufacturing, Nanostructures , Optimization, Particulate matter, Thin films
Proceedings Papers

Impacting a Clamped-Free Beam to Experimentally and Numerically Determine Higher Resonant Frequencies of Vibration

Elvin B. Shields
Proc. ASME. IDETC-CIE2016, Volume 8: 28th Conference on Mechanical Vibration and Noise, V008T10A027, August 21–24, 2016
Paper No: DETC2016-59044
DOI: https://doi.org/10.1115/DETC2016-59044
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Topics: Resonance, Vibration, Condensers (steam plant), Microphones, Finite element methods, Accelerometers, Experimental methods, Stiffness, Additive manufacturing, Cantilevers
Proceedings Papers

Deployment Simulation of Miura-Origami Membrane Structures

Jianguo Cai, Zheng Ren, Yifan Ding, Jian Feng, Xiaowei Deng, Wu Zhou, Yixiang Xu
Proc. ASME. IDETC-CIE2016, Volume 5B: 40th Mechanisms and Robotics Conference, V05BT07A002, August 21–24, 2016
Paper No: DETC2016-59113
DOI: https://doi.org/10.1115/DETC2016-59113
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Topics: Membranes, Simulation, Computer simulation, Computer software, Elastic moduli, Finite element analysis, Materials properties, Poisson ratio, Stress concentration, Tension
Proceedings Papers

Performance Comparison of a Bulk Thermoelectric Cooler With a Hybrid Device Architecture

Margaret Antonik, Scott M. Ferguson, Brendan T. O’Connor
Proc. ASME. IDETC-CIE2015, Volume 2B: 41st Design Automation Conference, V02BT03A013, August 2–5, 2015
Paper No: DETC2015-47610
DOI: https://doi.org/10.1115/DETC2015-47610
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Topics: Thermoelectric coolers, Architecture, Cooling, Design, Electric current, Geometry, Manufacturing, Performance, Performance characterization, Polymers
Proceedings Papers

Dynamics of Thin-Film Piezoelectric Vertical-Rotational Scanning Actuator

Choong-Ho Rhee, Zhen Qiu, Jongsoo Choi, Thomas D. Wang, Kenn R. Oldham
Proc. ASME. IDETC-CIE2015, Volume 4: 20th Design for Manufacturing and the Life Cycle Conference; 9th International Conference on Micro- and Nanosystems, V004T09A026, August 2–5, 2015
Paper No: DETC2015-47169
DOI: https://doi.org/10.1115/DETC2015-47169
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Topics: Actuators, Dynamics (Mechanics), Thin films, Mirrors, Resonance, Displacement, Imaging, Microactuators, Microscopy, Photons
Proceedings Papers

A Novel Non-Enzymatic Electrochemical Glucose Biosensor Based on a Simple Lithographic Process

Che-Wei Hsu, Fang-Ci Su, Po-Yu Peng, Hong-Tsu Young, Mike Yang, Gou-Jen Wang
Proc. ASME. IDETC-CIE2015, Volume 4: 20th Design for Manufacturing and the Life Cycle Conference; 9th International Conference on Micro- and Nanosystems, V004T09A004, August 2–5, 2015
Paper No: DETC2015-46954
DOI: https://doi.org/10.1115/DETC2015-46954
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Topics: Biosensors, Glucose, Enzymes, Photoresists, Diabetes, Biomedicine, Blood glucose, Blood glucose measurement, Electrodes, Manufacturing