This paper proposes a hybrid (semi-analytic) solution for determining the contact footprint and subsurface stress field in a two-dimensional adhesive problem involving a multi-layered elastic solid loaded normally by a rigid indenter. The subsurface stress field is determined using a semi-analytic solution and the footprint using a fast converging iterative algorithm. The solid to be indented consists of a graded elasticity coating with exponential increase of decay of its shear modulus bonded on a homogeneously elastic substrate. By applying the Fourier Transform to the governing boundary value problem, we formulate expressions for the stresses and displacements induced by the application of line forces acting both normally and tangentially at the origin. The superposition principle is then used to generalize these expressions to the case of distributed normal pressure acting on the solid surface. A pair of coupled integral equations are further derived for the parabolic stamp problem which are easily solved using collocation methods.
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ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 17–20, 2014
Buffalo, New York, USA
Conference Sponsors:
- Design Engineering Division
- Computers and Information in Engineering Division
ISBN:
978-0-7918-4635-3
PROCEEDINGS PAPER
Semi-Analytic Iterative Solution for the Adhesive Contact Between a Micro-Indenter and a Graded Elasticity Coating
Stewart J. Chidlow,
Stewart J. Chidlow
Oxford Brooks University, Oxford, UK
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William W. F. Chong,
William W. F. Chong
Southampton University, Malaysia Campus, Nusajaya, Johor, Malaysia
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Mircea Teodorescu
Mircea Teodorescu
University of California Santa Cruz, Santa Cruz, CA
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Stewart J. Chidlow
Oxford Brooks University, Oxford, UK
William W. F. Chong
Southampton University, Malaysia Campus, Nusajaya, Johor, Malaysia
Mircea Teodorescu
University of California Santa Cruz, Santa Cruz, CA
Paper No:
DETC2014-35110, V004T09A026; 5 pages
Published Online:
January 13, 2015
Citation
Chidlow, SJ, Chong, WWF, & Teodorescu, M. "Semi-Analytic Iterative Solution for the Adhesive Contact Between a Micro-Indenter and a Graded Elasticity Coating." Proceedings of the ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 4: 19th Design for Manufacturing and the Life Cycle Conference; 8th International Conference on Micro- and Nanosystems. Buffalo, New York, USA. August 17–20, 2014. V004T09A026. ASME. https://doi.org/10.1115/DETC2014-35110
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