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Proceedings Papers

A Loop Heat Pipe for Vehicle CPU Cooling: Peak Performance and Partial Flooding and Dryout Regimes

Julio Ferreira, Massoud Kaviany, Vincent Dupont, Olivier de Laet, Thomas Nicolle, Erik Yen
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A001, July 11–13, 2022
Paper No: HT2022-83836
DOI: https://doi.org/10.1115/HT2022-83836
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Topics: Computer cooling, Floods, Heat pipes, Vehicles
Proceedings Papers

Improved Femtosecond 3D Light Field Lithography With a Phase-Controlled Spatial Light Modulator

Aravind Jakkinapalli, Sy-Bor Wen
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A003, July 11–13, 2022
Paper No: HT2022-85681
DOI: https://doi.org/10.1115/HT2022-85681
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Topics: Lasers, Lithography
Proceedings Papers

Optimal Design of Additively Manufactured Metal Lattice Heat Sinks for Electronics Cooling

Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T16A002, July 11–13, 2022
Paper No: HT2022-85400
DOI: https://doi.org/10.1115/HT2022-85400
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Topics: Additive manufacturing, Computer cooling, Cooling, Design, Heat sinks, Metals, Optimization, Thermal management
Proceedings Papers

Thermo-Hydraulic Performance of Heat Sinks With Microchannel Embedded With Pin-fins

Anas Alkhazaleh, Mohamed Younes El-Saghir Selim, Fadi Alnaimat, Bobby Mathew
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T06A002, June 16–18, 2021
Paper No: HT2021-62804
DOI: https://doi.org/10.1115/HT2021-62804
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Topics: Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance
Proceedings Papers

Characterizing Heat Transfer Enhancement in Ferrofluid 2-D Channel Flows Using Mixing Numbers

Nadish Anand, Richard Gould
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T06A003, June 16–18, 2021
Paper No: HT2021-63795
DOI: https://doi.org/10.1115/HT2021-63795
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Topics: Channel flow, Ferrofluids, Heat transfer
Proceedings Papers

A Comparative Study of 1-D and 3-D Simulation Methodologies To Predict the Thermal Performance of a Power Electronics Hardware

Ankit Tiwari, Craig Whitaker, Brian Kendall
Proc. ASME. HT2021, ASME 2021 Heat Transfer Summer Conference, V001T06A001, June 16–18, 2021
Paper No: HT2021-62306
DOI: https://doi.org/10.1115/HT2021-62306
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Topics: Computational fluid dynamics, Electronics, Hardware, Heat transfer, Simulation, Radiation (Physics), Thermal analysis, Convection, Heat sinks, Temperature
Proceedings Papers

Comparative Study of Heat Transfer in a Mini/Micro Pipe With Water and Liquid Metal As Fluid

Xu-Dong Zhang, Jian-Ye Gao, Jing Liu
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T10A001, July 13–15, 2020
Paper No: HT2020-8966
DOI: https://doi.org/10.1115/HT2020-8966
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Topics: Fluids, Heat transfer, Liquid metals, Pipes, Water
Proceedings Papers

Effect of Rack Models and Buoyancy Forces on a Small Data Center Facility

Beichao Hu, Long Phan, Cheng-Xian Lin
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T08A004, July 14–17, 2019
Paper No: HT2019-3709
DOI: https://doi.org/10.1115/HT2019-3709
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Topics: Buoyancy, Data centers, Computational fluid dynamics, Simulation, Tiles, Design, Flow (Dynamics), Heat, Power density, Simulation results
Proceedings Papers

Numerical Simulation of Flow Boiling in Micro Channel to Study Bubble Dynamics

Uday Kumar Alugoju, Satish Kumar Dubey, Arshad Javed
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T08A001, July 14–17, 2019
Paper No: HT2019-3470
DOI: https://doi.org/10.1115/HT2019-3470
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Topics: Boiling, Bubbles, Computer simulation, Dynamics (Mechanics), Flow (Dynamics), Microchannels
Proceedings Papers

Numerical Study of Gas-Liquid Two-Phase Flow in Ultra-High-Aspect-Ratio Microchannel With Capillary-Structured Wall

Xiang Mei, Zhenyu Liu, Huiying Wu
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T08A002, July 14–17, 2019
Paper No: HT2019-3567
DOI: https://doi.org/10.1115/HT2019-3567
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Topics: Flow (Dynamics), Microchannels, Two-phase flow
Proceedings Papers

The Effect of Chamber Pressure on the Thermal Performance of New Refrigerant R513a During Spray Cooling

Nabeel M. Abdulrazzaq, Azzam S. Salman, Noble Anumbe, Amitav Tikadar, Saad K. Oudah, Jamil Khan
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T08A003, July 14–17, 2019
Paper No: HT2019-3628
DOI: https://doi.org/10.1115/HT2019-3628
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Topics: Cooling, Pressure, Refrigerants, Refrigeration, Sprays
Proceedings Papers

Improving Cooling Efficiency by Using Mixed Tiles to Control Airflow Uniformity of Perforated Tiles in a Data Center Model

Long Phan, Sadhana Bhusal, Cheng-Xian Lin
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A005, July 9–12, 2017
Paper No: HT2017-5022
DOI: https://doi.org/10.1115/HT2017-5022
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Topics: Air flow, Cooling, Data centers, Tiles, Computers, Stress, Density, Energy consumption, Heat, Power density
Proceedings Papers

Convective Heat Transfer of Ethanol/Polyalphaolefin Nanoemulsion Inside Circular Minichannel Heat Exchanger

Fana Zewede, Henok Argaw, Thanh Tran, Jiajun Xu
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A006, July 9–12, 2017
Paper No: HT2017-4808
DOI: https://doi.org/10.1115/HT2017-4808
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Topics: Convection, Ethanol, Heat exchangers, Fluids, Flow (Dynamics), Heat transfer, Laminar flow, Boiling, Bubbles, Heat transfer coefficients
Proceedings Papers

Numerical Evaluation of Clearance Requirements Around Obstructions in Finned Heat Sinks

Steven Miner
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A001, July 9–12, 2017
Paper No: HT2017-4715
DOI: https://doi.org/10.1115/HT2017-4715
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Topics: Clearances (Engineering), Heat sinks, Flow (Dynamics), Plates (structures), Electronic components, Fins, Fluid dynamics, Heat transfer, Operating temperature, Pressure drop
Proceedings Papers

Reducing Crossflow Effects in Arrays of Impinging Jets

Nicholas R. Arens, Mitchell P. Morem, Jeffrey Doom, Gregory J. Michna
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A007, July 9–12, 2017
Paper No: HT2017-4849
DOI: https://doi.org/10.1115/HT2017-4849
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Topics: Jets, Heat transfer, Nozzles, Computational fluid dynamics, Flow (Dynamics), Fluids, Microelectronic devices, Simulation, Thermal management, Additive manufacturing
Proceedings Papers

Material Distribution Optimization in a Metal Matrix Heat Sink Using a Constructal-Design Inspired Unit T-Cell

Jacob Kephart, G. F. Jones
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A002, July 9–12, 2017
Paper No: HT2017-4950
DOI: https://doi.org/10.1115/HT2017-4950
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Topics: Design, Heat sinks, Metals, Optimization, Geometry, Flow (Dynamics), Porosity, Convection, Coolants, Cooling
Proceedings Papers

Fabrication and Thermal Characterization of Novel Copper-CNT Micropillars for Electronics Cooling Applications

Siavash Ghanbari, Jeff Darabi
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A008, July 9–12, 2017
Paper No: HT2017-4935
DOI: https://doi.org/10.1115/HT2017-4935
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Topics: Carbon nanotubes, Computer cooling, Copper, Manufacturing, Thermal characterization, Composite materials, Pressure, Carbon, Cooling systems, Electrodeposition
Proceedings Papers

Temperature Measurement of Microscale Electronic Devices With 3D Thermoreflectance Imaging

Hongjie Zhang, Sy-Bor Wen
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A003, July 9–12, 2017
Paper No: HT2017-4954
DOI: https://doi.org/10.1115/HT2017-4954
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Topics: Imaging, Microscale devices, Temperature measurement, Thermoreflectance, Signals, Temperature distribution, Calibration, Construction, Field theories (Physics), High temperature
Proceedings Papers

Numerical Analysis of Thermal Transport in Nano Fluidic Porous Filled Heat Exchangers for Electronics Cooling

Carlos Zing, Shadi Mahjoob
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A009, July 9–12, 2017
Paper No: HT2017-4966
DOI: https://doi.org/10.1115/HT2017-4966
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Topics: Computer cooling, Heat exchangers, Numerical analysis, Water, Coolants, Cooling, Copper, Electronics, Nanofluids, Operating temperature
Proceedings Papers

Investigation of the Thermal Behaviour of Thin Phase Change Material Packages as a Solution to Temperature Control in Electronics

Benjamin Sponagle, Simon Maranda, Dominic Groulx
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A004, July 9–12, 2017
Paper No: HT2017-4801
DOI: https://doi.org/10.1115/HT2017-4801
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Topics: Electronics, Phase change materials, Temperature control, Temperature, Computer simulation, Electronic systems, Finite element methods, Thermal energy storage, Thermal management