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Proceedings Papers

Fabrication and Thermal Characterization of Novel Copper-CNT Micropillars for Electronics Cooling Applications

Siavash Ghanbari, Jeff Darabi
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A008, July 9–12, 2017
Paper No: HT2017-4935
DOI: https://doi.org/10.1115/HT2017-4935
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Topics: Carbon nanotubes, Computer cooling, Copper, Manufacturing, Thermal characterization, Composite materials, Pressure, Carbon, Cooling systems, Electrodeposition
Proceedings Papers

Two-Step Raman Method for Interface Thermal Resistance and In-Plane Thermal Conductivity Characterization of Graphene Interface Materials

Man Li, Yanan Yue
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A005, July 10–14, 2016
Paper No: HT2016-7362
DOI: https://doi.org/10.1115/HT2016-7362
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Topics: Graphene, Thermal conductivity, Thermal resistance, Interfacial thermal resistance, Phonons, Heating, Temperature, Couplings, Electromagnetic scattering, Heat transfer
Proceedings Papers

Thermal Characterization of Polymer Composites by Using the 3-Omega Method

Dong-Wook Oh, Young Kim, Jun Seok Choi, Ook Joong Kim, Kong Hoon Lee
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T02A007, July 14–19, 2013
Paper No: HT2013-17762
DOI: https://doi.org/10.1115/HT2013-17762
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Topics: Polymer composites, Thermal characterization, Thermal conductivity, Thermal properties, Carbon fibers, Composite materials, Metals, Particulate matter, Polymers, Stainless steel
Proceedings Papers

Thermal Characterization of Bi-Material Microcantilevers: Thermal Conductance and Microscale Convection

Arvind Narayanaswamy, Ning Gu
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 793-800, July 19–23, 2009
Paper No: HT2009-88108
DOI: https://doi.org/10.1115/HT2009-88108
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Topics: Convection, Microcantilevers, Microscale devices, Thermal characterization, Thermal conductivity, Cantilevers, Heat transfer, Atomic force microscopy, Deflection, Sensors
Proceedings Papers

Thermal Conductivity Measurements and Modeling of Phase-Change GST Materials

Yizhang Yang, Taehee Jeong, Hendrik F. Hamann, Jimmy Zhu, Mehdi Asheghi
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 925-932, July 8–12, 2007
Paper No: HT2007-32830
DOI: https://doi.org/10.1115/HT2007-32830
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Topics: Modeling, Thermal conductivity, Cycles, Data storage systems, Density, Disks, Electrical resistance, Jitter, Optimization, Phase change materials
Proceedings Papers

Evaluation of Thermal Characterization Techniques and Tools for Thermal Conductivity Measurement of Sub 100 Angstrom Thick Silicon Layers

Keivan Etessam-Yazdani, Mehdi Asheghi
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 937-941, July 8–12, 2007
Paper No: HT2007-32904
DOI: https://doi.org/10.1115/HT2007-32904
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Topics: Silicon, Thermal characterization, Thermal conductivity measurement, Bridges (Structures), Heating, Joules, Metals, Phonons, Steady state, Temperature measurement
Proceedings Papers

Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications

Y. Yang, Chun-Teh Li, S. M. Sadeghipour, M. Asheghi, H. Dieker, M. Wuttig
Proc. ASME. HT2005, Heat Transfer: Volume 4, 837-843, July 17–22, 2005
Paper No: HT2005-72679
DOI: https://doi.org/10.1115/HT2005-72679
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Topics: Phase change materials, Thermal characterization, Metals, Electronic systems, Interfacial thermal resistance, MEMS packaging, Modeling, Nanoelectromechanical systems, Pacific Rim, Thermoreflectance
Proceedings Papers

Thermal Characterization of the 144 nm GMR Layer Using Microfabricated Suspended Structures

Shu Zhang, Yizhang Yang, Sadegh M. Sadeghipour, Mehdi Asheghi
Proc. ASME. HT2003, Heat Transfer: Volume 1, 89-92, July 21–23, 2003
Paper No: HT2003-47270
DOI: https://doi.org/10.1115/HT2003-47270
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Topics: Thermal characterization, Temperature, Sensors, Bridges (Structures), Heating, Modeling, Reliability, Steady state, Temperature measurement, Thermal conductivity