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Proceedings Papers

Local Heat Transfer Coefficients Measurement Under Micro Jet Impinging Using Nitrogen Gas (N 2 )

Jeong-Heon Shin, Tomer Rozenfeld, Ashwin Vutha, Yingying Wang, Gennady Ziskind, Yoav Peles

Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T05A003, July 10–14, 2016

Paper No: HT2016-7215

DOI: https://doi.org/10.1115/HT2016-7215

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Topics: Heat transfer coefficients, Nitrogen, Semiconductor wafers, Borosilicate glasses, Flow (Dynamics), Simulation, Temperature distribution, Cooling, Drilling, Fluids

Proceedings Papers

Spiral Microfluidics Device for Continuous Flow PCR

Reza Salemmilani, Barbaros Cetin

Proc. ASME. HT2013, Volume 2: Heat Transfer Enhancement for Practical Applications; Heat and Mass Transfer in Fire and Combustion; Heat Transfer in Multiphase Systems; Heat and Mass Transfer in Biotechnology, V002T11A001, July 14–19, 2013

Paper No: HT2013-17305

DOI: https://doi.org/10.1115/HT2013-17305

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Topics: Flow (Dynamics), Microfluidics, Biomedicine, Temperature, Chain, Design, DNA, Glass, Heating, Heating and cooling

Proceedings Papers

An Evaluation of Energy Transfer Pathways in Thermal Transport Across Solid/Solid Interfaces

Yan Wang, Xiulin Ruan

Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A041, July 14–19, 2013

Paper No: HT2013-17297

DOI: https://doi.org/10.1115/HT2013-17297

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Topics: Electrons, Energy transformation, Heat, Heat transfer, High temperature, Interfacial thermal resistance, Metallic thin films, Metals, Phonons, Semiconductor wafers

Proceedings Papers

Computational Investigation of the Fate of Aluminum Nitride Particles During Chemical Vapor Deposition

Derek Endres, Sandip Mazumder

Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 881-885, July 8–12, 2012

Paper No: HT2012-58030

DOI: https://doi.org/10.1115/HT2012-58030

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Topics: Aluminum, Chemical vapor deposition, Particulate matter, Chemical reactions, Computational fluid dynamics, Dynamics (Mechanics), Flow (Dynamics), Metalorganic chemical vapor deposition, Nanoparticles, Semiconductor wafers

Proceedings Papers

Study on Behavior of Rewetting on Hot Wall

Hiroyasu Ohtake, Yasuo Koizumi, Shingo Kobayashi, Takeshi Watanabe

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 555-559, July 8–12, 2007

Paper No: HT2007-32860

DOI: https://doi.org/10.1115/HT2007-32860

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Topics: Collapse, Film boiling, Flow (Dynamics), Heat conduction, Hydrodynamics, Pool boiling, Semiconductor wafers, Subcooling, Superheating, Temperature

Proceedings Papers

Effects of Geometrical Parameters in the DS Method for the Growth of Large Sized Polycrystal Silicon

Jung-Hoon Hwang, Youn-Jea Kim, Joong-Won Shur, Dae-Ho Yoon

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 307-314, July 8–12, 2007

Paper No: HT2007-32172

DOI: https://doi.org/10.1115/HT2007-32172

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Topics: Casting, Computational fluid dynamics, Computer simulation, Cycles, Feedstock, Fluid dynamics, Heat exchangers, Heat losses, Heat transfer, Polysilicon

Proceedings Papers

Reverse Monte Carlo Modeling of Signal Transport in Light-Pipe Radiation Thermometers

Hakan Erturk, Ofodike A. Ezekoye, John R. Howell

Proc. ASME. HT2008, Heat Transfer: Volume 1, 633-640, August 10–14, 2008

Paper No: HT2008-56180

DOI: https://doi.org/10.1115/HT2008-56180

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Topics: Modeling, Pipes, Radiation (Physics), Signals, Thermometers, Rapid thermal processing, Errors, Monte Carlo methods, Quartz, Temperature

Proceedings Papers

Investigation of Lightpipe Volumetric Radiation Effects in RTP Thermometry

D. J. Frankman, B. W. Webb, M. R. Jones

Proc. ASME. HT2005, Heat Transfer: Volume 4, 199-209, July 17–22, 2005

Paper No: HT2005-72285

DOI: https://doi.org/10.1115/HT2005-72285

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Topics: Radiation effects, Temperature measurement, Semiconductor wafers, Radiation (Physics), Radiative heat transfer, Temperature, Temperature profiles, Accounting, Heat conduction, Rapid thermal processing

Proceedings Papers

Fluid Flow and Heat Transfer in a Composite Trapezoidal Microchannel

Muhammad M. Rahman, Shantanu S. Shevade

Proc. ASME. HT2005, Heat Transfer: Volume 1, 411-417, July 17–22, 2005

Paper No: HT2005-72407

DOI: https://doi.org/10.1115/HT2005-72407

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Topics: Composite materials, Fluid dynamics, Heat transfer, Microchannels, Gadolinium, Fluids, Heat, Heat exchangers, Heat transfer coefficients, Magnetic fields

Proceedings Papers

Feature Evolution During Sub 100NM Gap-Fill and Etch

Hemant Mungekar, Young S. Lee, Shankar Venkataraman

Proc. ASME. HT2005, Heat Transfer: Volume 3, 221-224, July 17–22, 2005

Paper No: HT2005-72326

DOI: https://doi.org/10.1115/HT2005-72326

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Topics: Etching, Pressure, Plasmas (Ionized gases), Design, Electric fields, Electronics, Integrated circuit fabrication, Ions, Plasma density, Process design

Proceedings Papers

Modeling and Simulation of Physical Vapor Deposition/Etching Plasmas

Umesh Kelkar, Arvind Sundarrajan, Tza-Jing Gung, Ned Hammond, Ajay Bhatnagar, Xinyu Fu, Mark Perrin, John Forster, Prabu Gopalraja, Jianming Fu

Proc. ASME. HT2005, Heat Transfer: Volume 3, 225-227, July 17–22, 2005

Paper No: HT2005-72338

DOI: https://doi.org/10.1115/HT2005-72338

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Topics: Etching, Modeling, Plasmas (Ionized gases), Simulation, Vapor deposition, Flux (Metallurgy), Magnetic fields, Particulate matter, Semiconductor wafers, Simulation results

Proceedings Papers

Laser Surface Texturing: Applications and Research Opportunities

David A. Willis

Proc. ASME. HT2005, Heat Transfer: Volume 3, 311-313, July 17–22, 2005

Paper No: HT2005-72676

DOI: https://doi.org/10.1115/HT2005-72676

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Topics: Lasers, Drops, Melting, Semiconductor wafers, Density, Displacement, Fluence (Radiation measurement), Metallic films, Metals, Microelectromechanical systems

Proceedings Papers

Enhancement of Thermal Bubble Nucleation From Micro Cavity Filled With Porous Materials

Young-Soo Chang, Heon Ju Lee, Ho-Young Kim, Sang-Youp Oh, Yoon-Pyo Lee

Proc. ASME. HT2005, Heat Transfer: Volume 2, 139-141, July 17–22, 2005

Paper No: HT2005-72488

DOI: https://doi.org/10.1115/HT2005-72488

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Topics: Bubbles, Cavities, Nucleation (Physics), Porous materials, Boiling, Temperature, Cooling systems, Design, Fluids, Geometry

Proceedings Papers

Experiment of Micro Cantilever Deflection by Thermal Bubble Growth in Liquid

Heon J. Lee, Young-Soo Chang, Ho-Young Kim, Jong-Seob Ahn, Yoon-Pyo Lee

Proc. ASME. HT2005, Heat Transfer: Volume 2, 487-489, July 17–22, 2005

Paper No: HT2005-72486

DOI: https://doi.org/10.1115/HT2005-72486

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Topics: Bubbles, Deflection, Microcantilevers, Microelectromechanical systems, Atomic force microscopy, Cantilever beams, Cantilevers, Dry etching, Geometry, Manufacturing

Proceedings Papers

Microscale Boiling Heat Transfer Near the Meniscus

Brenda E. Haendler, David C. Walther, Dorian Liepmann, Albert P. Pisano

Proc. ASME. HT2005, Heat Transfer: Volume 2, 91-98, July 17–22, 2005

Paper No: HT2005-72315

DOI: https://doi.org/10.1115/HT2005-72315

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Topics: Boiling, Heat transfer, Microscale devices, Semiconductor wafers, Temperature, Temperature profiles, Microchannels, Borosilicate glasses, Computer software, Engines

Proceedings Papers

Characteristics of Nucleation and Bubble Growth During Microscale Boiling

Yong Tian, Jiang-Tao Liu, Xiao-Feng Peng

Proc. ASME. HT2005, Heat Transfer: Volume 2, 225-231, July 17–22, 2005

Paper No: HT2005-72723

DOI: https://doi.org/10.1115/HT2005-72723

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Topics: Boiling, Bubbles, Microscale devices, Nucleation (Physics), Microchannels, Differential equations, Dynamics (Mechanics), Evaporation, Microscopes, Semiconductor wafers

Proceedings Papers

Drawdown-Effect of Lightpipes in Silicon Wafer Surface Temperature Measurements

Yan Qu, Ekachai Puttitwong, John R. Howell, Ofodike A. Ezekoye, Kenneth S. Ball

Proc. ASME. HT2005, Heat Transfer: Volume 4, 193-198, July 17–22, 2005

Paper No: HT2005-72203

DOI: https://doi.org/10.1115/HT2005-72203

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Topics: Semiconductor wafers, Temperature measurement, Temperature, Semiconductors (Materials), Uncertainty, Calibration, Radiation (Physics), Thermometers

Proceedings Papers

Mixed Convection in a Large Area Atmospheric Pressure CVD Reactor

S. P. Vanka, Gang Luo, Nick G. Glumac

Proc. ASME. HT-FED2004, Volume 3, 901-911, July 11–15, 2004

Paper No: HT-FED2004-56231

DOI: https://doi.org/10.1115/HT-FED2004-56231

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Topics: Atmospheric pressure, Chemical vapor deposition, Mixed convection, Flow (Dynamics), Geometry, Corners (Structural elements), Semiconductor wafers, Shear (Mechanics), Damping, Nozzles

Proceedings Papers

Heat and Mass Transport in HDP-CVD Chamber

Hemant Mungekar, Bruno Geoffrion, Bikram Kapoor, Naren Dubey, Mak Salimian, Michael Cox, Paddy Krishnaraj

Proc. ASME. HT2003, Heat Transfer: Volume 3, 23-27, July 21–23, 2003

Paper No: HT2003-47030

DOI: https://doi.org/10.1115/HT2003-47030

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Topics: Chemical vapor deposition, Heat, Plasmas (Ionized gases), Dimensions, Fluid mechanics, Hardware, Heat transfer, Manufacturing, Mass transfer, Metals

Proceedings Papers

Predictions of Radiative Properties of Patterned Silicon Wafers by Solving Maxwell’s Equations in the Time Domain

J. Liu, S. J. Zhang, Y. S. Chen

Proc. ASME. HT2003, Heat Transfer: Volume 3, 239-249, July 21–23, 2003

Paper No: HT2003-47424

DOI: https://doi.org/10.1115/HT2003-47424

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Topics: Semiconductor wafers, Errors, Boundary-value problems, Electromagnetic fields, Finite difference time-domain analysis, Geometry, Poynting vector, Radiation (Physics), Reflection, Steady state

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