Topics: Computers, Phase change materials, Thermal management, Melting, Temperature, Laminates, Dynamic light scattering, Heat, Heat flux, Printed circuit boards

Topics: Heat pipes, Thermal management, Heat transfer, Heat, Printed circuit board assemblies, Avionics, Bonding, Energy dissipation, Fluids, Heat conduction

Topics: Cooling, Heat, Boiling, Flat heat pipes, Heat flux, Temperature, Computer simulation, Copper, Dielectric liquids, Energy dissipation

Topics: Clearances (Engineering), Cooling, Electronic equipment, Heating, Temperature, Copper, Modeling, Electronic products, Flow (Dynamics), Natural convection

Topics: Convection, Design, Entropy, Printed circuit boards, Optimization, Electronic packages, Geometry, Reynolds number, Channel flow, Cooling

Topics: Strain gages, Coatings, Gages, Lasers, Capacitance, Temperature, Computers, Copper, Glass reinforced plastics, High temperature

Topics: Condensation, Electrodes, Heat exchangers, Printed circuit boards, Shells, Electric fields, Electrohydrodynamics, Heat flux, Heat transfer, Refrigerants

Topics: Heat, Printed circuit boards, Thermal management, Separation (Technology), Computational fluid dynamics, Density, Experimental design, Geometry, Maintenance, Natural convection

Topics: Composite materials, Lumber, Optimization, Thermal stresses, Fibers, Stress, Finite element model, Heat transfer coefficients, Temperature gradient, Computational fluid dynamics

Topics: Circuit design, Cooling, Design, Electronic equipment, Flow simulation, Natural convection, Power semiconductor devices, Computational fluid dynamics, Heat, Circuits

Topics: Computational fluid dynamics, Electronic components, Temperature, Heat transfer, Junctions, Thermal analysis, Turbulence, Air flow, Boundary-value problems, Design

Topics: Forced convection, Mixed convection, Natural convection, Printed circuit boards, Energy dissipation, Computer cooling, Electronics, Flow (Dynamics), Heat, Heat flux

Topics: Cooling, Actuators, Flow (Dynamics), Heat transfer coefficients, Particulate matter, Plates (structures), Printed circuit boards, Vortices, Diffusion (Physics), Electronic packages