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Proceedings Papers

Thermal Conductivity Study of Biomass Reinforced Polymer Composites

Birce Dikici, Samarth Motagi, Prahruth Kantamani, Suma Ayyagari, Marwan Al-Haik
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T11A008, July 13–15, 2020
Paper No: HT2020-9065
DOI: https://doi.org/10.1115/HT2020-9065
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Topics: Biomass, Polymer composites, Thermal conductivity, Ester, Fibers, Resins, Cellulosic fibers, Composite materials, Epoxy adhesives, Epoxy resins
Proceedings Papers

Thermal Conductivity Testing Apparatus for 3D Printed Materials

Tiffaney Flaata, Gregory J. Michna, Todd Letcher
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T15A006, July 9–12, 2017
Paper No: HT2017-4856
DOI: https://doi.org/10.1115/HT2017-4856
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Topics: Additive manufacturing, Testing, Thermal conductivity, Polymer composites, Heat exchangers, Heat transfer, Metals, Polymers, Brass (Metal), Bronze
Proceedings Papers

Zinc Composites With Enhanced Thermal Conductivity for Use in Fused Deposition Modeling Systems

Tyler J. Sonsalla, Leland Weiss, Arden Moore, Adarsh Radadia, Debbie Wood, Davis Bailey
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T10A011, July 9–12, 2017
Paper No: HT2017-5062
DOI: https://doi.org/10.1115/HT2017-5062
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Topics: Composite materials, Modeling, Thermal conductivity, Fillers (Materials), Energy dissipation, Heat exchangers, Heat recovery, Manufacturing, Materials properties, Polymer composites
Proceedings Papers

Thermal Characterization of Polymer Composites by Using the 3-Omega Method

Dong-Wook Oh, Young Kim, Jun Seok Choi, Ook Joong Kim, Kong Hoon Lee
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T02A007, July 14–19, 2013
Paper No: HT2013-17762
DOI: https://doi.org/10.1115/HT2013-17762
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Topics: Polymer composites, Thermal characterization, Thermal conductivity, Thermal properties, Carbon fibers, Composite materials, Metals, Particulate matter, Polymers, Stainless steel
Proceedings Papers

Simulation of Thermal Transport in a Nanocomposite Blow Mold

M. K. Alam, P. Klein, D. Garg
Proc. ASME. HT2009, Volume 3: Combustion, Fire and Reacting Flow; Heat Transfer in Multiphase Systems; Heat Transfer in Transport Phenomena in Manufacturing and Materials Processing; Heat and Mass Transfer in Biotechnology; Low Temperature Heat Transfer; Environmental Heat Transfer; Heat Transfer Education; Visualization of Heat Transfer, 639-644, July 19–23, 2009
Paper No: HT2009-88265
DOI: https://doi.org/10.1115/HT2009-88265
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Topics: Nanocomposites, Simulation, Composite materials, Design, Cycles, Manufacturing, Metals, Molding, Polymers, Carbon
Proceedings Papers

Tailoring Thermoelectric Properties of Segregated-Network Polymer Nanocomposites for Thermoelectric Energy Conversion

Kyungwho Choi, Dasaroyong Kim, Yeonseok Kim, Jaime C. Grunlan, Choongho Yu
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 165-167, July 19–23, 2009
Paper No: HT2009-88177
DOI: https://doi.org/10.1115/HT2009-88177
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Topics: Carbon nanotubes, Composite materials, Conducting polymers, Electrical conductivity, Energy conversion, Fillers (Materials), Polymer composites, Polymer nanocomposites, Polymers
Proceedings Papers

Characterization of Interdigital Capacitive Strain Gauges by Direct Write Technology

Jinggao Li, Jon P. Longtin, Szymon Tankiewicz, Andrew Gouldstone, Sanjay Sampath
Proc. ASME. HT2005, Heat Transfer: Volume 3, 237-243, July 17–22, 2005
Paper No: HT2005-72769
DOI: https://doi.org/10.1115/HT2005-72769
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Topics: Strain gages, Coatings, Gages, Lasers, Capacitance, Temperature, Computers, Copper, Glass reinforced plastics, High temperature