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Proceedings Papers

Multi-Source Thermal Model for Electrical Harness Design

Julien Petitgirard, Philippe Baucour, Didier Chamagne, Eric Fouillien
Proc. ASME. HT2019, ASME 2019 Heat Transfer Summer Conference, V001T02A006, July 14–17, 2019
Paper No: HT2019-3516
DOI: https://doi.org/10.1115/HT2019-3516
View Paper titled, Multi-Source Thermal Model for Electrical Harness Design
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Topics: Design, Wire, Electrical wires, Heat, Complex systems, Convection, Finite element analysis, Flux (Metallurgy), Geothermal engineering, Heat exchangers
Proceedings Papers

Cryogenic Temperature Monitoring via Optical PDMS Sensors

Matthew Frenkel, Zhixiong Guo
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T13A003, July 10–14, 2016
Paper No: HT2016-7188
DOI: https://doi.org/10.1115/HT2016-7188
View Paper titled, Cryogenic Temperature Monitoring via Optical PDMS Sensors
Click here to open pdf in another window PDF for Cryogenic Temperature Monitoring via Optical PDMS Sensors
Topics: Plasma desorption mass spectrometry, Sensors, Temperature, Electrical wires, Electronic components, Heating, Joules, Low temperature, Microsensors, Nitrogen
Proceedings Papers

Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks

Tohru Suwa, Hamid Hadim
Proc. ASME. HT2008, Heat Transfer: Volume 2, 779-787, August 10–14, 2008
Paper No: HT2008-56056
DOI: https://doi.org/10.1115/HT2008-56056
View Paper titled, Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks
Click here to open pdf in another window PDF for Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks
Topics: Design, Electrical wires, Heat, Optimization, Semiconductors (Materials)