1-7 of 7
Capacitance
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Review of Molten Salt Nanofluids

Farzam Mortazavi, Debjyoti Banerjee
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T03A011, July 10–14, 2016
Paper No: HT2016-7316
DOI: https://doi.org/10.1115/HT2016-7316
View Paper titled, Review of Molten Salt Nanofluids
Click here to open pdf in another window PDF for Review of Molten Salt Nanofluids
Topics: Nanofluids, Nanoparticles, Specific heat, Thermal conductivity, Fluids, Temperature, Energy generation, Molecular dynamics simulation, Rheology, Agglomeration (Materials)
Proceedings Papers

An Experimental Study of Boiling Heat Transfer During Quenching of Nanofluids With Carbon Nanotubes of Various Sizes

Jia-Qi Li, Li-Wu Fan, Liang Zhang, Zi-Tao Yu
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T08A002, July 10–14, 2016
Paper No: HT2016-7319
DOI: https://doi.org/10.1115/HT2016-7319
View Paper titled, An Experimental Study of Boiling Heat Transfer During Quenching of Nanofluids With Carbon Nanotubes of Various Sizes
Click here to open pdf in another window PDF for An Experimental Study of Boiling Heat Transfer During Quenching of Nanofluids With Carbon Nanotubes of Various Sizes
Topics: Boiling, Carbon nanotubes, Heat transfer, Nanofluids, Quenching (Metalworking), Surface roughness, Critical heat flux, Temperature, Transients (Dynamics), Capacitance
Proceedings Papers

Heat Transfer Coefficient Characterization for Hot Stamping of Boron Steel Blanks

Etienne Caron, Kyle J. Daun, Mary A. Wells, Badri Ratnam
Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 899-905, July 8–12, 2012
Paper No: HT2012-58074
DOI: https://doi.org/10.1115/HT2012-58074
View Paper titled, Heat Transfer Coefficient Characterization for Hot Stamping of Boron Steel Blanks
Click here to open pdf in another window PDF for Heat Transfer Coefficient Characterization for Hot Stamping of Boron Steel Blanks
Topics: Blanks, Boron, Heat transfer coefficients, Metal stamping, Steel, Cooling, Heat conduction, Mechanical properties, Quenching (Metalworking), Sheet metal
Proceedings Papers

A Simple Model for Transient Thermal Behavior of Integrated Circuit Package Systems for Use in Determining a Thermal Design Power

Julia C. Huang, Niyati Pise, Deepak Ganapathy, Shushanth Prabhu, Ethan J. Warner
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 839-846, July 19–23, 2009
Paper No: HT2009-88229
DOI: https://doi.org/10.1115/HT2009-88229
View Paper titled, A Simple Model for Transient Thermal Behavior of Integrated Circuit Package Systems for Use in Determining a Thermal Design Power
Click here to open pdf in another window PDF for A Simple Model for Transient Thermal Behavior of Integrated Circuit Package Systems for Use in Determining a Thermal Design Power
Topics: Design, Integrated circuits, Transients (Dynamics), Capacitance, Cooling, Electronic components, Energy dissipation, Engineers, Heat sinks, Network models
Proceedings Papers

Heat Transfer at an Evaporating Front in Porous Media

V. K. Chaitanya Pakala, O. A. Plumb
Proc. ASME. HT2009, Volume 3: Combustion, Fire and Reacting Flow; Heat Transfer in Multiphase Systems; Heat Transfer in Transport Phenomena in Manufacturing and Materials Processing; Heat and Mass Transfer in Biotechnology; Low Temperature Heat Transfer; Environmental Heat Transfer; Heat Transfer Education; Visualization of Heat Transfer, 317-326, July 19–23, 2009
Paper No: HT2009-88240
DOI: https://doi.org/10.1115/HT2009-88240
View Paper titled, Heat Transfer at an Evaporating Front in Porous Media
Click here to open pdf in another window PDF for Heat Transfer at an Evaporating Front in Porous Media
Topics: Evaporation, Heat transfer, Porous materials, Diffusion (Physics), Water, Approximation, Capacitance, Coal, Computer simulation, Drying
Proceedings Papers

Spiral-Plate Heat Exchanger Effectiveness With Equal Capacitance Rates

Louis C. Burmeister
Proc. ASME. HT2005, Heat Transfer: Volume 4, 305-313, July 17–22, 2005
Paper No: HT2005-72041
DOI: https://doi.org/10.1115/HT2005-72041
View Paper titled, Spiral-Plate Heat Exchanger Effectiveness With Equal Capacitance Rates
Click here to open pdf in another window PDF for Spiral-Plate Heat Exchanger Effectiveness With Equal Capacitance Rates
Topics: Capacitance, Heat exchangers
Proceedings Papers

Characterization of Interdigital Capacitive Strain Gauges by Direct Write Technology

Jinggao Li, Jon P. Longtin, Szymon Tankiewicz, Andrew Gouldstone, Sanjay Sampath
Proc. ASME. HT2005, Heat Transfer: Volume 3, 237-243, July 17–22, 2005
Paper No: HT2005-72769
DOI: https://doi.org/10.1115/HT2005-72769
View Paper titled, Characterization of Interdigital Capacitive Strain Gauges by Direct Write Technology
Click here to open pdf in another window PDF for Characterization of Interdigital Capacitive Strain Gauges by Direct Write Technology
Topics: Strain gages, Coatings, Gages, Lasers, Capacitance, Temperature, Computers, Copper, Glass reinforced plastics, High temperature