The design of portable electronic systems for use in hot and humid conditions represents a significant design challenge for packaging engineers. Humidity drives a range of failure mechanisms: the alteration of material properties; hygro-mechanical stress phenomena; and the acceleration of corrosion and material migration. Moreover, portable electronic products such as mobile phones, CD players and digital cameras can experience rapidly varying conditions of temperature and humidity which, in certain conditions, can cause condensation to form on the internal and external surfaces of the product. Condensation — or even very high relative humidity — is a severe stimulus because it greatly accelerates corrosion and migration mechanisms. This paper considers the response of portable electronics to transient variations of temperature and humidity in order to assess the conditions under which condensation is likely to occur. A first-order coupled hygrothermal model is developed to represent the temperature and humidity response of a typical portable product using simple time constants. Experimental characterisation of a sample product is performed to evaluate the parameters of the model, and it is demonstrated how movement from one environment to another can precipitate condensation. This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
The Response of Portable Electronics to Transient Conditions of Temperature and Humidity
Jeff Punch,
Jeff Punch
University of Limerick, Limerick, Ireland
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Ronan Grimes,
Ronan Grimes
University of Limerick, Limerick, Ireland
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Greg Heaslip,
Greg Heaslip
University of Limerick, Limerick, Ireland
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Timo Galkin,
Timo Galkin
Nokia Corporation, Helsinki, Finland
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Kyo¨sti Va¨keva¨inen,
Kyo¨sti Va¨keva¨inen
Nokia Corporation, Helsinki, Finland
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Vesa Kyyhkynen,
Vesa Kyyhkynen
Nokia Corporation, Helsinki, Finland
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Erkko Elonen
Erkko Elonen
Nokia Corporation, Helsinki, Finland
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Jeff Punch
University of Limerick, Limerick, Ireland
Ronan Grimes
University of Limerick, Limerick, Ireland
Greg Heaslip
University of Limerick, Limerick, Ireland
Timo Galkin
Nokia Corporation, Helsinki, Finland
Kyo¨sti Va¨keva¨inen
Nokia Corporation, Helsinki, Finland
Vesa Kyyhkynen
Nokia Corporation, Helsinki, Finland
Erkko Elonen
Nokia Corporation, Helsinki, Finland
Paper No:
HT2005-72578, pp. 871-876; 6 pages
Published Online:
March 9, 2009
Citation
Punch, J, Grimes, R, Heaslip, G, Galkin, T, Va¨keva¨inen, K, Kyyhkynen, V, & Elonen, E. "The Response of Portable Electronics to Transient Conditions of Temperature and Humidity." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 871-876. ASME. https://doi.org/10.1115/HT2005-72578
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