As the trend of high throughput in small packages continues, the heat dissipation becomes a very critical design issue in electronic devices and spacecrafts. The two phase loop heat pipe utilizes the latent heat of working fluid. It consists of an evaporator, compensation chamber, condenser, and liquid and vapor line. The primary wick used as a core part to circulate the working fluid is located in the evaporator. The planar loop heat pipe uses coherent porous silicon (CPS) wick as opposed to the conventional cylindrical configuration, which uses a sintered amorphous metal wick. The clear evaporator machined from Pyrex glass and transparent silicone tubes were utilized to monitor the complex phenomena which occur in the evaporator. Tests were conducted under the non-vacuum condition without a secondary wick. DI-water was used as a working fluid. Like an open loop test previously conducted, there was an operating range in which the liquid could be properly pumped from the compensation chamber to the vapor line under the pumping motion. In this device, more than 6 Watts could be convected from the evaporator to the ambient. Therefore circulation was not observed until powers greater than 6 Watts. There was a circulation of working fluid occurring due to energy transport within the loop when the input power was from 7.94 Watts to 17.6 Watts. The quantity of heat transportation to the loop was calculated by acquiring the empirical heat transfer coefficient. From this calculation it was found that, roughly, 12.1 Watts was transported to the loop and 5.51 Watts was convected to the ambient from the evaporator itself when the applied power was 15.27 Watts. This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4734-9
PROCEEDINGS PAPER
Operating Ranges of the Planar Loop Heat Pipe Under Non-Vacuum Conditions
Junwoo Suh,
Junwoo Suh
University of Cincinnati, Cincinnati, OH
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Ahmed Shuja,
Ahmed Shuja
University of Cincinnati, Cincinnati, OH
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Praveen Medis,
Praveen Medis
University of Cincinnati, Cincinnati, OH
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Srinivas Parimi,
Srinivas Parimi
University of Cincinnati, Cincinnati, OH
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Frank M. Gerner,
Frank M. Gerner
University of Cincinnati, Cincinnati, OH
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H. Thurman Henderson
H. Thurman Henderson
University of Cincinnati, Cincinnati, OH
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Junwoo Suh
University of Cincinnati, Cincinnati, OH
Ahmed Shuja
University of Cincinnati, Cincinnati, OH
Praveen Medis
University of Cincinnati, Cincinnati, OH
Srinivas Parimi
University of Cincinnati, Cincinnati, OH
Frank M. Gerner
University of Cincinnati, Cincinnati, OH
H. Thurman Henderson
University of Cincinnati, Cincinnati, OH
Paper No:
HT2005-72381, pp. 737-742; 6 pages
Published Online:
March 9, 2009
Citation
Suh, J, Shuja, A, Medis, P, Parimi, S, Gerner, FM, & Henderson, HT. "Operating Ranges of the Planar Loop Heat Pipe Under Non-Vacuum Conditions." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 4. San Francisco, California, USA. July 17–22, 2005. pp. 737-742. ASME. https://doi.org/10.1115/HT2005-72381
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