Heat transfer considerations are important in almost all areas of technology. However, heat transfer analysis can be very difficult for complicated systems such as very large-scale integrated (VLSI) electric circuits and systems, making the simulation an attractive technique for studying heat transfer of those systems. This paper presents methods of heat transfer simulation using PSpice. First, typical heat transfer modes are discussed and heat transfer equations are presented. Then, equivalent electrical models are developed, and PSpice representations of those models are investigated. Finite-difference RC network models are developed and used for the simulation of complicated heat transfer problems using PSpice. Two typical heat transfer examples are studied. Simulations are performed to investigate and study the heat transfer and energy flow of the two examples using PSpice.
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ASME 2003 Heat Transfer Summer Conference
July 21–23, 2003
Las Vegas, Nevada, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-3695-9
PROCEEDINGS PAPER
Heat Transfer Simulation Using PSpice
Shuhui Li,
Shuhui Li
Texas A&M University at Kingsville, Kingsville, TX
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Rajab Challoo,
Rajab Challoo
Texas A&M University at Kingsville, Kingsville, TX
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Robert A. McLauchlan
Robert A. McLauchlan
Texas A&M University at Kingsville, Kingsville, TX
Search for other works by this author on:
Shuhui Li
Texas A&M University at Kingsville, Kingsville, TX
Rajab Challoo
Texas A&M University at Kingsville, Kingsville, TX
Robert A. McLauchlan
Texas A&M University at Kingsville, Kingsville, TX
Paper No:
HT2003-47021, pp. 589-595; 7 pages
Published Online:
December 17, 2008
Citation
Li, S, Challoo, R, & McLauchlan, RA. "Heat Transfer Simulation Using PSpice." Proceedings of the ASME 2003 Heat Transfer Summer Conference. Heat Transfer: Volume 3. Las Vegas, Nevada, USA. July 21–23, 2003. pp. 589-595. ASME. https://doi.org/10.1115/HT2003-47021
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