Nanoparticle-based materials have demonstrated extremely low thermal conductivities, a property that has made them attractive candidates in a variety of macroscale and microscale applications. Understanding the thermal transport between nanoparticles is necessary for the further development of these materials. Molecular dynamics simulation is an effective method to investigate thermal transport on these scales because no assumption about phonon transmission at the nanoparticle interface, nor prior knowledge of thermal transport of the system is necessary. In this work, the total thermal resistance between adjacent amorphous silica nanoparticles is calculated using non-equilibrium molecular dynamics simulations (NEMD). Numerical results show that interparticle resistance depends strongly on the forces between particles, in particular the presence or absence of chemical bonds between nanoparticles. In addition, the effect of interfacial force strength on thermal resistance increases as nanoparticle diameter decreases. Numerical results are compared to interparticle resistances determined from the predictions of the analytical constriction resistance model. The simulation results are shown to be in good agreement the constriction resistance theory depending on the choice of surface energy.
- Heat Transfer Division
Molecular Dynamics Study on Thermal Resistance Between Amorphous Silica Nanoparticles
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Meng, F, Liu, J, & Richards, RF. "Molecular Dynamics Study on Thermal Resistance Between Amorphous Silica Nanoparticles." Proceedings of the ASME 2017 Heat Transfer Summer Conference. Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing. Bellevue, Washington, USA. July 9–12, 2017. V002T13A002. ASME. https://doi.org/10.1115/HT2017-4894
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