An investigation of the stagnation point heat transfer coefficient of such a single-phase, microscale impinging jet is discussed. Standard MEMS processes were used to fabricate a heat transfer measurement device. In this device, a water jet issued from a 67-μm orifice and impinged on an 80-μm square heated normal surface 200 μm from the orifice. Heat transfer coefficients up to 80,000 W/m2-K were measured. This heat transfer coefficient results in a heat flux greater than 400 W/cm2 given a 50°C temperature difference. However, this heat transfer coefficient is an order-of-magnitude less than that predicted by correlations developed from larger jets. In addition, the heat transfer coefficients were relatively insensitive to Reynolds number. Further investigation of microjet heat transfer is needed to explain this deviation from expected behavior. The pressure drop across the jet orifice was measured, and the calculated pressure loss coefficients agree well with available correlations. Curve fits for the Nusselt number and pressure loss coefficient are given.
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ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4356-7
PROCEEDINGS PAPER
Single Microjet Heat Transfer
Gregory J. Michna,
Gregory J. Michna
Rensselaer Polytechnic Institute, Troy, NY
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Eric A. Browne,
Eric A. Browne
Rensselaer Polytechnic Institute, Troy, NY
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Yoav Peles,
Yoav Peles
Rensselaer Polytechnic Institute, Troy, NY
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Michael K. Jensen
Michael K. Jensen
Rensselaer Polytechnic Institute, Troy, NY
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Gregory J. Michna
Rensselaer Polytechnic Institute, Troy, NY
Eric A. Browne
Rensselaer Polytechnic Institute, Troy, NY
Yoav Peles
Rensselaer Polytechnic Institute, Troy, NY
Michael K. Jensen
Rensselaer Polytechnic Institute, Troy, NY
Paper No:
HT2009-88216, pp. 821-828; 8 pages
Published Online:
March 12, 2010
Citation
Michna, GJ, Browne, EA, Peles, Y, & Jensen, MK. "Single Microjet Heat Transfer." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment. San Francisco, California, USA. July 19–23, 2009. pp. 821-828. ASME. https://doi.org/10.1115/HT2009-88216
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