Pump-probe transient thermoreflectance (TTR) techniques are powerful tools for measuring thermophysical properties of thin films, such as thermal conductivity, Λ, or thermal boundary conductance, G. TTR experimental setups rely on lock-in techniques to detect the response of the probe signal relative to the pump heating event. The temporal decays of the lock-in signal are then compared to thermal models to deduce the Λ and G in and across various materials. There are currently two thermal models that are used to relate the measured signals from the lock-in to the Λ and G in the sample of interest. In this work, the thermal models, their assumptions, and their ranges of applicability are compared. The advantages and disadvantages of each technique are elucidated from the results of the thermophysical property measurements.
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ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4356-7
PROCEEDINGS PAPER
Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques
Patrick E. Hopkins,
Patrick E. Hopkins
Sandia National Laboratories, Albuquerque, NM
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Justin R. Serrano,
Justin R. Serrano
Sandia National Laboratories, Albuquerque, NM
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Leslie M. Phinney
Leslie M. Phinney
Sandia National Laboratories, Albuquerque, NM
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Patrick E. Hopkins
Sandia National Laboratories, Albuquerque, NM
Justin R. Serrano
Sandia National Laboratories, Albuquerque, NM
Leslie M. Phinney
Sandia National Laboratories, Albuquerque, NM
Paper No:
HT2009-88269, pp. 497-503; 7 pages
Published Online:
March 12, 2010
Citation
Hopkins, PE, Serrano, JR, & Phinney, LM. "Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment. San Francisco, California, USA. July 19–23, 2009. pp. 497-503. ASME. https://doi.org/10.1115/HT2009-88269
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