Thermophoresis is a significant deposition mechanism for the fouling of exhaust gas recirculation (EGR) coolers. The present paper is motivated by the need to understand and predict the rates of deposition of soot particles in heat exchanger fins used in EGR coolers. This preliminary study considers flat plate channels in the laminar and transitional turbulent regimes. Because of the nano-meter range of the particles, an Eulerian approach is used to determine the particle concentration. Full consideration is given to property variations due to changes in temperature. The inlet gas is at a fixed temperature and the effects of wall temperature are studied for several Reynolds numbers in laminar and transitional turbulent regimes. A finite difference method is used to march downstream in both laminar and transitional turbulent flows. The Launder-Sharma two-equation low-Reynolds-number k-ε model is employed in the numerical simulations to obtain data about flow friction, heat transfer and mass transfer.
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ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4356-7
PROCEEDINGS PAPER
Numerical Study of Thermophoretic Deposition in Laminar and Turbulent Variable-Property Flat Plate Channel Flow
M. A. Goodwin,
M. A. Goodwin
University of Illinois at Urbana-Champaign, Urbana, IL
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A. F. Shinn,
A. F. Shinn
University of Illinois at Urbana-Champaign, Urbana, IL
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S. P. Vanka
S. P. Vanka
University of Illinois at Urbana-Champaign, Urbana, IL
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M. A. Goodwin
University of Illinois at Urbana-Champaign, Urbana, IL
A. F. Shinn
University of Illinois at Urbana-Champaign, Urbana, IL
S. P. Vanka
University of Illinois at Urbana-Champaign, Urbana, IL
Paper No:
HT2009-88369, pp. 311-320; 10 pages
Published Online:
March 12, 2010
Citation
Goodwin, MA, Shinn, AF, & Vanka, SP. "Numerical Study of Thermophoretic Deposition in Laminar and Turbulent Variable-Property Flat Plate Channel Flow." Proceedings of the ASME 2009 Heat Transfer Summer Conference collocated with the InterPACK09 and 3rd Energy Sustainability Conferences. Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment. San Francisco, California, USA. July 19–23, 2009. pp. 311-320. ASME. https://doi.org/10.1115/HT2009-88369
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