Two-phase thermal management technologies are promising cooling solutions for the high performance electronics in the next generation military and commercial vehicles. However, vibrations (∼ 10Grms in commercial automobile engines and transmissions) and shocks (30G to 1,200G in military combat vehicles, caused by gun firing, ballistic launch and abrupt maneuvering) present a severe challenge to any capillary-driven (i.e., passive) two-phase devices. A low-cost, vibration/shock-tolerant Capillary Two-Phase Loop (CTPL) technology was developed as a cooling alternative for the future military vehicles. Unlike the traditional two-phase cooling loops such as Loop Heat Pipes (LHP) and Capillary Pumped Loops (CPL), the CTPL offers the following advantages: (1) lower manufacturing cost by sintering the evaporator wick in-situ; (2) improved tolerance to vibrations and shocks due to the improved mechanical strengths of the in-situ sintered wick; (3) improved heat flux performance because of the non-inverted meniscus wick. Small-scale proof-to-concept CTPL prototypes were successfully tested up to 120W of heat input and under multiple, consecutive shocks of up to 6.6G.
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ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences
August 10–14, 2008
Jacksonville, Florida, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4848-7
PROCEEDINGS PAPER
Vibration/Shock-Tolerant Capillary Two-Phase Loop Technology for Vehicle Thermal Control
Xudong Tang,
Xudong Tang
Advanced Cooling Technologies, Inc., Lancaster, PA
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Chanwoo Park
Chanwoo Park
University of Nevada, Reno, NV
Search for other works by this author on:
Xudong Tang
Advanced Cooling Technologies, Inc., Lancaster, PA
Chanwoo Park
University of Nevada, Reno, NV
Paper No:
HT2008-56349, pp. 531-537; 7 pages
Published Online:
July 7, 2009
Citation
Tang, X, & Park, C. "Vibration/Shock-Tolerant Capillary Two-Phase Loop Technology for Vehicle Thermal Control." Proceedings of the ASME 2008 Heat Transfer Summer Conference collocated with the Fluids Engineering, Energy Sustainability, and 3rd Energy Nanotechnology Conferences. Heat Transfer: Volume 2. Jacksonville, Florida, USA. August 10–14, 2008. pp. 531-537. ASME. https://doi.org/10.1115/HT2008-56349
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