A numerical model was developed to study the electromagnetic field and thermal phenomena during microwave heating food processing. Three-dimensional finite difference time domain and finite element integration is presented for the analysis of the electromagnetic field distribution and temperature distribution. Experimental measurements validated 3-D model of microwave food processing for the electromagnetic and thermal phenomena. The extensive numerical simulations were used to study effect of various processing parameters on the heating patterns in food package in a 915 MHz microwave applicator. Computed results are presented for the electric field distribution, power absorption and temperature profile for the food sterilization processing in Microwave-Circulated Water Combination (MCWC) heating system.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4733-0
PROCEEDINGS PAPER
Validation of 3-D Electromagnetic-Thermal Model for Microwave Food Processing
H. K. Lee,
H. K. Lee
Washington State University, Pullman, WA
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B. Q. Li,
B. Q. Li
Washington State University, Pullman, WA
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J. Tang
J. Tang
Washington State University, Pullman, WA
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H. K. Lee
Washington State University, Pullman, WA
B. Q. Li
Washington State University, Pullman, WA
Y. Huo
Washington State University, Pullman, WA
J. Tang
Washington State University, Pullman, WA
Paper No:
HT2005-72534, pp. 781-786; 6 pages
Published Online:
March 9, 2009
Citation
Lee, HK, Li, BQ, Huo, Y, & Tang, J. "Validation of 3-D Electromagnetic-Thermal Model for Microwave Food Processing." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 3. San Francisco, California, USA. July 17–22, 2005. pp. 781-786. ASME. https://doi.org/10.1115/HT2005-72534
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