A fundamental knowledge of the parameters affecting film condensation is essential for the design of two phase heat exchangers. The current study examines the effect of extended surfaces and surface energy modifications and their interaction for condensation of steam in quiescent and vapor flow conditions. The enhancement of heat transfer for vertical, flat surfaces and two finned surfaces were compared for Reynolds numbers ranging from approximately 10 to 50. The addition of a nonionic surfactant, alcohol alkoxylate, to the system was evaluated for the same surfaces and vapor field conditions. Vapor flow of 0.25 m/s enhanced the heat transfer approximately 40%, while 0.5 m/s vapor velocity produced almost 100% increase in heat transfer. The addition of surfactant to the system produced small enhancement in heat transfer except in the case of condensate hold-up between the fins. In this case, the addition of surfactant increase the heat transfer an additional 25%, likely because the vapor flow and change of surface energy were sufficient to largely eliminate the hold-up of condensate between the fins.
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ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4732-2
PROCEEDINGS PAPER
Condensation of Steam on Finned Surfaces With Addition of a Surfactant
Andrew T. Morrison,
Andrew T. Morrison
University of Texas at Arlington, Arlington, TX
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S. M. You
S. M. You
University of Texas at Arlington, Arlington, TX
Search for other works by this author on:
Andrew T. Morrison
University of Texas at Arlington, Arlington, TX
S. M. You
University of Texas at Arlington, Arlington, TX
Paper No:
HT2005-72155, pp. 271-278; 8 pages
Published Online:
March 9, 2009
Citation
Morrison, AT, & You, SM. "Condensation of Steam on Finned Surfaces With Addition of a Surfactant." Proceedings of the ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. Heat Transfer: Volume 2. San Francisco, California, USA. July 17–22, 2005. pp. 271-278. ASME. https://doi.org/10.1115/HT2005-72155
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